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BA8
Category
Wafer BondersOverview
The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm. Wafer Bonder
Active Listings
3
Services
Inspection, Insurance, Appraisal, Logistics
Top Listings
SUSS MicroTec / KARL SUSS
BA8
Wafer BondersVintage: 2006Condition: UsedLast VerifiedOver 30 days agoSUSS MicroTec / KARL SUSS
BA8
Wafer BondersVintage: Condition: UsedLast VerifiedOver 60 days ago- PREFERREDSELLER
SUSS MicroTec / KARL SUSS
BA8
Wafer BondersVintage: Condition: UsedLast VerifiedOver 60 days ago
