The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm.

Wafer Bonder

SUSS MicroTec offers a wide product portfolio of high quality process solutions for the semiconductor industry and related markets. SUSS portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding, and photomask processing, complemented by micro-optical components. 

SUSS MicroTec / KARL SUSS

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BA8

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SUSS MicroTec / KARL SUSS

BA8

SUSS MicroTec / KARL SUSS

BA8

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