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SUSS MicroTec / KARL SUSS BA8
    Description
    Contact Aligner
    Configuration
    No Configuration
    OEM Model Description
    The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm. Wafer Bonder
    Documents

    No documents

    SUSS MicroTec / KARL SUSS

    BA8

    verified-listing-icon

    Verified

    CATEGORY
    Wafer Bonders

    Last Verified: Over 60 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Installed / Idle

    Product ID:

    116406

    Wafer Sizes:

    Unknown

    Vintage:

    2006

    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    SUSS MicroTec / KARL SUSS BA8

    SUSS MicroTec / KARL SUSS

    BA8

    Wafer Bonders
    Vintage: 2006Condition: Used
    Last VerifiedOver 60 days ago
    SUSS MicroTec / KARL SUSS BA8

    SUSS MicroTec / KARL SUSS

    BA8

    Wafer Bonders
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    SUSS MicroTec / KARL SUSS

    BA8

    verified-listing-icon
    Verified
    CATEGORY
    Wafer Bonders
    Last Verified: Over 60 days ago
    listing-photo-59018c06867b4079b80f866e53d2de8c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/87594/59018c06867b4079b80f866e53d2de8c/a962007567644aaabe48f5ecf8b6f335_101adc20cfcc4ae89c9f9d670f9966ad45005c_mw.jpeg
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    listing-photo-59018c06867b4079b80f866e53d2de8c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/87594/59018c06867b4079b80f866e53d2de8c/3148d01b2e294063b838aa9ace871e4a_62a8ca05253d4635b2c05dfcd88f2e81_mw.jpeg
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    listing-photo-59018c06867b4079b80f866e53d2de8c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/87594/59018c06867b4079b80f866e53d2de8c/0265d51f039c4d728f19ee3038220208_a30c3ec9e14042c8b8b19a6bf8ab798f_mw.jpeg
    listing-photo-59018c06867b4079b80f866e53d2de8c-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/87594/59018c06867b4079b80f866e53d2de8c/1179216d67a04aedafb2d28046fb9ad0_0baad12bcc194fb5995feabcd45ebc0f1201a_mw.jpeg
    Key Item Details
    Condition:

    Used

    Operational Status:

    Installed / Idle

    Product ID:

    116406

    Wafer Sizes:

    Unknown

    Vintage:

    2006

    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Contact Aligner
    Configuration
    No Configuration
    OEM Model Description
    The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm. Wafer Bonder
    Documents

    No documents

    Similar Listings
    View All
    SUSS MicroTec / KARL SUSS BA8

    SUSS MicroTec / KARL SUSS

    BA8

    Wafer BondersVintage: 2006Condition: UsedLast Verified:Over 60 days ago
    SUSS MicroTec / KARL SUSS BA8

    SUSS MicroTec / KARL SUSS

    BA8

    Wafer BondersVintage: 0Condition: UsedLast Verified:Over 60 days ago