Overview

The BA8 Gen4 Pro bond alignment platform is designed for demanding processes in MEMS and LED production and advanced packaging markets. It accurately aligns substrates and secures their position in fixtures for further process steps. The bond alignment of two wafers is based on the same powerful technology that has proven its value with SUSS MicroTec’s mask aligners for mask to wafer alignment. The platform can be configured as a bond aligner only or as a combination of mask and bond aligner. A direct bonding toolkit offers extra functionality for pre-bonding substrates. In order to enhance direct bonding processes, the BA8 Gen4 Pro can be equipped with an optional toolkit for selective and full-wafer surface activation. It can easily be upgraded with additional functions within a short time. The system handles substrates up to 200 mm in size. With its ergonomic operation and intuitive user interface, the BA8 Gen4 Pro is easy to work with and requires only minimal operator training. Its high degree of automation allows for easy operation and an application in labs, research and development as well as small series production. Wafer Bonder