Overview

Automated Coaters and Developers The modular system of ACS300 Gen3 is specifically designed for demanding high-volume production environments. It provides sophisticated coating, developing and baking functionalities that can be easily adapted to various processes. Maximum process control effectively supports the wide field of use. This, together with the smallest footprint on the market for a system with eight spinner modules, all qualities positively affecting cost-of-ownership, make the tool indispensable for any challenging advanced packaging application such as wafer-level chip-scale packaging, fan-out wafer-level packaging, copper pillar flip-chip packaging and 3D packaging.