Description
Coater and developerConfiguration
150 WPH Dual-block configuration Utilized with Nikon S610i General: iUSC SECS I / SECS II / HSMS / GEM interface compatibility (Qty 5) Interfaced blocks: cassette block, (Qty 2) process blocks, scanner interface (main and sub) (Qty 5) Wafer-transfer robot arms: cassette, (Qty 2) process, scanner interface (main and sub) Cassette block: (Qty 4) FOUP loadports RFID capability Pressure sensor Process block: (Qty 3) Coater (COT) modules (Qty 4) Temperature-controlled 1.2 mm resist nozzles per coater 4 L or 1 L Nowpak bottle insert Exhaust pressure controller (EPC) per coater (Qty 2) Immersion top coater (ITC) modules (Qty 2) Temperature-controlled 1.2 mm resist nozzles per ITC (Qty 5) Developer (DEV) modules (Qty 2) Temperature-controlled NLD nozzles per developer SRN rev2 nozzle with main and sub nozzles Phase 0 pre-plumbing for future FIRM field retrofit option Pre-plumbing (N2 line only) for future PDR field retrofit option (Qty 4) Adhesion (ADH) modules (Qty 9) Chill plate (CPL) modules with optical wafer-wedging detection enabled Transfer chill plate (WCPL) module (Qty 5) Transfer low-temperature hot plate (CLHP) modules, pre-plumbed for future CPHG field retrofit option CLHP wafer-wedging detection via plate temperature sensors (Qty 9) Precision chilling hot plate (CPHG) modules for soft bake or post-exposure bake CPHG wafer-wedging detection via plate temperature sensors 0.1 mm gap PEEK proximity pins on chilling arm WEE module: pre-plumbed only Interface block: IRAS i dual-pincette wafer-handling robot (Qty 2) Post-immersion rinse (PIR) modules Buffer cassette (Qty 2) Interface chilling plates (ICPL) Subcomponents: TEL temperature and humidity controller (Qty 2) Chemical cabinets AC power boxOEM Model Description
The CLEAN TRACK™ LITHIUS™ Series is the latest coater/developer equipped with high-technology succeeding from the CLEAN TRACK™ ACT™ series. The key concepts are extensibility to advanced processes, high throughput, reduced footprint, improved OEE (Overall Equipment Efficiency), and CoO (Cost of Ownership) reduction. Successor to the ACT - 200mm or 300mm, more modules and faster throughput (150 wph).Documents
No documents
Verified
CATEGORY
Coaters & Developers
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
157399
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
LITHIUS
CATEGORY
Coaters & Developers
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
157399
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Coater and developerConfiguration
150 WPH Dual-block configuration Utilized with Nikon S610i General: iUSC SECS I / SECS II / HSMS / GEM interface compatibility (Qty 5) Interfaced blocks: cassette block, (Qty 2) process blocks, scanner interface (main and sub) (Qty 5) Wafer-transfer robot arms: cassette, (Qty 2) process, scanner interface (main and sub) Cassette block: (Qty 4) FOUP loadports RFID capability Pressure sensor Process block: (Qty 3) Coater (COT) modules (Qty 4) Temperature-controlled 1.2 mm resist nozzles per coater 4 L or 1 L Nowpak bottle insert Exhaust pressure controller (EPC) per coater (Qty 2) Immersion top coater (ITC) modules (Qty 2) Temperature-controlled 1.2 mm resist nozzles per ITC (Qty 5) Developer (DEV) modules (Qty 2) Temperature-controlled NLD nozzles per developer SRN rev2 nozzle with main and sub nozzles Phase 0 pre-plumbing for future FIRM field retrofit option Pre-plumbing (N2 line only) for future PDR field retrofit option (Qty 4) Adhesion (ADH) modules (Qty 9) Chill plate (CPL) modules with optical wafer-wedging detection enabled Transfer chill plate (WCPL) module (Qty 5) Transfer low-temperature hot plate (CLHP) modules, pre-plumbed for future CPHG field retrofit option CLHP wafer-wedging detection via plate temperature sensors (Qty 9) Precision chilling hot plate (CPHG) modules for soft bake or post-exposure bake CPHG wafer-wedging detection via plate temperature sensors 0.1 mm gap PEEK proximity pins on chilling arm WEE module: pre-plumbed only Interface block: IRAS i dual-pincette wafer-handling robot (Qty 2) Post-immersion rinse (PIR) modules Buffer cassette (Qty 2) Interface chilling plates (ICPL) Subcomponents: TEL temperature and humidity controller (Qty 2) Chemical cabinets AC power boxOEM Model Description
The CLEAN TRACK™ LITHIUS™ Series is the latest coater/developer equipped with high-technology succeeding from the CLEAN TRACK™ ACT™ series. The key concepts are extensibility to advanced processes, high throughput, reduced footprint, improved OEE (Overall Equipment Efficiency), and CoO (Cost of Ownership) reduction. Successor to the ACT - 200mm or 300mm, more modules and faster throughput (150 wph).Documents
No documents