EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

LITHOSCALE is a revolutionary, highly versatile maskless exposure lithography platform geared for a variety of microfabrication applications accommodating wafers up to 300 mm.

EVGroup (EVG)

LITHOSCALE

Automated production bonding system for a wide range of fusion/molecular wafer bonding applications
Wafer bonding is one key enabling technology for the SOI wafer fabrication process as well as for wafer-level 3D integration and advanced packaging. With the EVG850 LT automated production bonding system for mechanically aligned SOI and direct wafer bonding with LowTemp™ plasma activation, all essential steps for fusion bonding – from cleaning, plasma activation and alignment to pre-bonding and IR-inspection – are combined. Thus, the field-proven, industry-standard EVG850 LT assures a high-throughput, high-yield production process for void-free SOI wafers up to 300 mm sizes.

Wafer Bonder

 EVG850 LT

EVG105 LA is a large area resist processing system >300mm.

EVG150 LA

EVG750 is an automated hot embossing system up to 200mm.

EVG750

The EVG®620 NT provides state-of-the art mask alignment technology on a minimized footprint area up to 150 mm wafer size.
Known for its versatility and reliability, the EVG620 NT provides state-of-the-art mask alignment technology on a minimized footprint area combined with advanced alignment features and optimized total cost of ownership. It is an ideal tool for optical double-side lithography available in semi-automated or automated configuration with optional full-housing Gen 2 solution to meet high-volume production requirements and fab standards. Operator-friendly software, minimized time for mask and tooling changes, as well as efficient worldwide service and support makes it the ideal solution for any manufacturing environment. The EVG620 NT or the fully housed EVG620 NT Gen2 mask alignment systems are equipped with integrated vibration isolation, and achieve excellent exposure results for a wide range of applications, such as exposure of thin and thick resists, patterning of deep cavities and comparable topographies, as well as processing of thin and fragile materials such as compound semiconductors. Furthermore, the EVG’s proprietary SmartNIL technology is supported on both semi-automated and fully automated system configurations.

EVG620 NT

The EVG610 bond alignment system is designed for wafer-to-wafer alignment up to 200 mm wafer sizes. EV Group's bond alignment systems offer a manual high-precision alignment stage with bottom-side microscope. The precision of EVG's bond alignment system accommodates the most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.

Wafer Bonder

EVG610 BA

The EVG750 roll-to-roll hot-embossing system is designed for R&D as well as pilot manufacturing of all-in-plastic flexible substrates for applications ranging from anti-counterfeiting, surface texturing (photovoltaics, displays, sensors) to biofunctional constructs. The system combines an automated foil handling unit for unwinding and rewinding with the core embossing module and accepts 300 mm wide films with thicknesses ranging from 50 µm to 1000 µm. In addition, the EVG750 roll-to-roll hot-embossing system has the ability to handle exotic films which are not available on large rolls and automatically detects the splicing film line through an optical sensor and adjusts the position of the structuring cylinder via encoders to the tape position. 

EVG750 R2R

High-vacuum wafer bonding platform facilitating covalent bonds of “anything on anything”.

Wafer Bonder

COMBOND

The EVG610 is a versatile lithography system that supports various standard processes including vacuum, hard, soft, and proximity exposure modes, with an added feature of back-side alignment. It also provides extra capabilities such as bond alignment and nanoimprint lithography (NIL). The system is designed for quick processing and easy reconfiguration to meet changing requirements, boasting a conversion time of just a few minutes. Its user-friendly design caters to all skill levels, from beginners to experts, making it an excellent choice for universities and R&D applications.

EVG610

EVG101 LA is a large area coating system for >300mm

EVG101 LA

EVG7200 LA is a semi-automated large-area SmartNIL system up to 370 x 470 mm (Gen2)

EVG7200 LA-Gen2

The EVG520 HE is a cutting-edge semi-automated hot embossing system, specifically tailored for high-precision thermoplastic substrate imprinting. Capable of accommodating substrates up to 200 mm in diameter, it seamlessly integrates with industry-standard semiconductor manufacturing technologies. The system features high-vacuum and high-contact force capabilities, along with a universal embossing chamber, ensuring efficient and reliable processing. Its versatility allows for working with a comprehensive range of polymers suitable for hot embossing applications, making it an ideal choice for advanced manufacturing needs. 

Wafer Bonder

EVG520 HE

EVG620 NT Gen2

EVG150 XT is an automated resist processing system up to 300mm.

EVG150 XT

EVG40

Step-and-Repeat Nanoimprint Lithography System

EVG770 NT

The EVG320 automated single wafer cleaning system handles wafers and substrates automatically between the process stations. The robot handling system ensures pre-alignment and loading of the wafers automatically in a cassette-to-cassette or FOUP-to-FOUP operation. Besides Di-water rinse, configuration options include megasonic, brush and diluted chemicals cleaning.

Die/wafer bonder

EVG320

The EVG320 D2W is a highly flexible platform that features a universal hardware/software interface to enable seamless integration with third-party pick-and-place die bonding systems. It also can operate as a stand-alone system depending on integration and line balancing requirements. The system incorporates EVG’s advanced cleaning and plasma activation technology, which is available across its industry-standard W2W fusion and hybrid bonding platforms and has been proven in hundreds of installed modules worldwide. In addition, the EVG320 D2W features EVG’s alignment verification module (AVM), an integrated metrology module that provides direct feedback to the die bonder on critical process parameters, such as die placement accuracy and die-height information as well as post-bond metrology, for improved process control. It also features flexible substrate handling that can accommodate any type of die carrier or film frame that can support plasma activation, hybrid and fusion bonding cleanliness standards, and SECS/GEM standard support.

 EVG320 D2W

BAL4

The EVG40 NT2 represents a major breakthrough in metrology performance to meet the new demands for the advanced packaging industry. It provides not only greater overlay accuracy but also a significant boost in throughput to enable higher measurement density per wafer, giving more detailed feedback on hybrid bonding performance, for example. This new metrology solution rounds out EVG’s comprehensive portfolio of process solutions for 3D/heterogeneous integration, and complements our existing EVG40 NT system, which remains the de facto bond metrology standard for MEMS and complex photonic devices. The EVG40 NT2 is already playing a key role in several joint development projects underway at EVG’s Heterogeneous Integration Competence Center™

EVG40 NT2

Hercules is a lithography track system up to 300mm.
The HERCULES is a high-volume platform integrating the entire lithography process flow in one system, reducing process footprint and operator support.

HERCULES

EVG850 TBL is an automated temporary bonding system with integrated lamination system up to 300mm.

Wafer Bonder

EVG850 TBL

EV 501S

UV-NIL

EVG770 is an automated NIL Stepper up to 300mm

EVG770

EVG850 DB XT Frame is an automated debonding system up to 300 mm.

EVG850 DB XT Frame

EVG510 HE is a semi-automated hot embossing system up to 200mm

Wafer Bonder

EVG510 HE

SmartNIL

EVG850 TB XT Frame is an automated bonding system
Wafer Bonder


EVG850 TB XT Frame

The EVG720 system is a mass manufacturing solution that uses EVG’s SmartNIL technology to create micro and nanoscale structures. It can print nanostructures as small as 40 nm across a large area, making it an ideal tool for producing next-generation microfluidic and photonic devices, such as diffractive optical elements. The system features volume-proven imprinting technology with superior replication fidelity, integrated imprinting, UV curing demolding, and working stamp fabrication. It also offers automated cassette-to-cassette handling with a semi-automated R&D mode, optional top-side alignment and mini-environment, and is compatible with all commercially available imprint materials. The system is scalable from R&D to production and ensures process stability and reliability. The technical specifications of the EVG720 include a wafer diameter ranging from 75 to 150 mm and a resolution of up to 40 nm, depending on the template and process used.

 EVG720

Hercules L is a lithography track system resist processing and expose configuration up to 300mm.

HERCULES L

High-throughput, high-resolution metrology for bonded stacks and single wafers.
The EVG50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG's high-volume-manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool's application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.

EVG50

Softbake, post-exposure bake and hardbake processes can be performed on the EVG105 bake module. Controlled baking environment assures uniform evaporation. Programmable proximity pins provide the best available control of resist hardening processes and temperature profiles. The EVG105 bake module can process up to 300 mm wafer sizes or up to four 100 mm wafers at the same time.

EVG105

The SmartView NT automated bond alignment system for universal alignment offers a proprietary method for micron-level face-to-face wafer-level alignment. This alignment technique is key to achieving the required accuracy in multiple wafer stacks for leading-edge technologies. SmartView technology can be combined with the GEMINI wafer bonding systems for subsequent permanent bonding in a fully automated platform.

Wafer Bonder

SMARTVIEW NT

EVG 20 IR Inspection System (stand-alone tool) Infrared Inspection Station (integrated module) 
The EVG20 offers a fast inspection method, especially for fusion bonded wafers. A live image of the entire wafer via IR transmission allows void detection down to a radius of 500 µm which is a perfect match for fusion bonding processes.  In addition, the infrared inspection system supports bond strength measurements using the Maszara method.

EVG20

The EVG560 automated wafer bonding system accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm. Based on the same bond chamber design and incorporating the key features of EVG's manual bonding systems with enhanced process control and automation, the EVG560 bonder delivers high-yield production bonds. A robot handling system automatically loads and unloads the process chambers.

EVG560

Automated Production Fusion Bonding System
EVG BONDSCALE is designed to fulfill a wide range of fusion/molecular wafer bonding applications, including engineered substrate manufacturing and 3D integration approaches that use layer-transfer processing, such as monolithic 3D (M3D). With BONDSCALE, EVG is bringing wafer bonding to front-end semiconductor processing and helping to address long-term challenges for "More Moore" logic device scaling identified in the International Roadmap for Devices and Systems (IRDS). Incorporating an enhanced edge alignment technology, BONDSCALE provides a significant boost in wafer bond productivity and lower cost of ownership (CoO) compared to existing fusion bonding platforms.

BONDSCALE

The EVG540 automated wafer bonding system is an automated single-chamber production bonder designed for pilot-line manufacturing as well as R&D for high-volume manufacturing in wafer-level packaging, 3D-interconnect and MEMS applications. Based on a modular design, the EVG540 provides a proven solution for future transition of wafer bonding processes from R&D to large-scale manufacturing on our fully integrated production bonding systems.

 EVG540

The IQ Aligner® NT is an automated mask alignment system up to 300mm. It optimized for zero-assist contactless proximity processing at highest throughput. The IQ Aligner NT is the most productive and technically advanced automated mask alignment system for high-volume applications. Featuring the most sophisticated print gab control and zero-assist dual-size wafer processing capability, the system fully addresses high-volume manufacturing (HVM) needs. It provides a 2X increase in throughput and a 2X improvement in alignment accuracy over EVG’s previous-generation IQ Aligner system, giving it the highest throughput of all mask aligners. The IQ Aligner NT surpasses the most demanding requirements for back-end lithography applications while providing up to 30 percent lower cost of ownership compared to competing systems growing out of the highest throughput supported on mask alignment tools.. With advanced wafer alignment run-out control, full-field mask movement capability and high-power UV light source, it is ideally suited for wafer bumping and interposer patterning, thereby serving a variety of advanced packaging types, including wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP), 3D-IC/through-silicon via (TSV), 2.5D interposers, and flip chip.

IQ ALIGNER NT

EVG6200 NT Gen2

EVG150 N is an automated nanospray coating system up to 300mm.

EVG150 N

EVG®540 Automated Chip-to-Wafer Bonding System
Single chamber production bonder up to 300 mm. Dedicated for chip-to-wafer and wafer-to-wafer bond processes. Unique compliant layer system to compensate chips thickness variations.

EVG540 C2W

The EVG7200 system leverages EVG's innovative SmartNIL technology and EVG's materials expertise to enable mass manufacturing of micro- and nanoscale structures. The system brings the advanced soft stamp and imprint capability of SmartNIL to larger substrates and smaller geometries, with resolution down to 40 nm* in volume production. This enables greater cost-of-ownership (CoO) benefits and realizes the full manufacturing potential of nanoimprint lithography.

EVG7200

EVG770 NT GEN2

Known for its high level of automation and reliability, the EVG620 bond alignment system is designed for wafer-to-wafer alignment up to 150 mm wafer sizes. EV Group´s bond alignment systems offer the highest precision, flexibility and ease of use, and modular upgrade capability, and have been qualified in numerous high-throughput production environments. The precision of EVG´s bond alignment system accommodates the most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.

Wafer Bonder

 EVG620 BA

Multifunctional UV Nanoimprint Lithography System


EVG7300

EVG7200 LA is a large-area SmartNIL UV-NIL system up to 550 mm x 650 mm (Gen3)

EVG7200 LA-Gen3

The EVG GEMINI FB XT is an advanced fusion bonding system designed for high-precision applications. It excels in memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning. The system incorporates the SmartView NT3 bond aligner, specifically developed for fusion and hybrid wafer bonding alignment with an impressive accuracy of less than 50 nm. It supports wafer diameters of 200mm and 300mm, offering a blend of productivity, alignment, and overlay precision.

Wafer Bonder

GEMINI FB XT

The EVG620 is a versatile tool developed by EV Group (EVG) that serves as both an optical double-side lithography and precision alignment system, specifically designed for wafers up to 100 mm in size. The system is capable of safely handling thick, bowed, or small diameter wafers, providing enhanced flexibility in wafer processing. The EVG620's alignment stage design is a standout feature, delivering highly accurate alignment and exposure results for precise patterning. It is equipped with high-resolution top and bottom side split-field microscopes, ensuring excellent imaging capabilities. The user-friendly interface, based on Windows, streamlines the operation of the EVG620, making it a reliable and efficient tool for various lithography and alignment applications in semiconductor and microelectronics manufacturing.

EVG620

A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.

GEMINI

EVG520

Automated production bonding system for a wide range of fusion/molecular wafer bonding applications
SOI wafers are a promising new basic material for the microelectronics industry to produce faster and higher-performance microelectronic devices. Wafer bonding, as one key enabling technology for the SOI wafer fabrication process, achieves high-quality single-crystal silicon films on insulating substrates. With the EVG850 SOI production bonding system, all essential steps for SOI bonding – from cleaning and alignment to pre-bonding and IR-inspection – are combined. Thus, the EVG850 assures a high-yield production process for void-free SOI wafers up to 300 mm sizes. Being the only production system built to operate in high-throughput, high-yield environments, the EVG850 has been established as the industry standard in the SOI wafer market.

 EVG850

EVG 101 Advanced Resist Processing System
The EVG101 resist processing system performs R&D-type processes on a single chamber design, which is fully compatible with EVG’s automated systems. The EVG101 supports wafers up to 300 mm and can be configured for spin or spray coating and developing. Conformal layers of photoresist or polymers are achieved on 3D structured wafers for interconnection techniques with EVG’s advanced OmniSpray coating technology. This ensures low material consumption of precious high-viscosity photoresists or polymers while improving uniformity and resist spreading options.

EVG101

Automated resist processing system providing high-throughput performance and supporting wafers up to 300 mm in diameter

EVG150

H-line system with double-sided mask alignment capabilities

EV420

EVG640

The EVG120 universal and fully automated resist processing tool is capable of processing various substrate shapes and sizes up to 200 mm/8". This new generation of the EVG120 comes in a new ultra-compact design with newly developed chemistry cabinet for external storage of chemicals while providing increased throughput capability, optimized for high-volume customer needs and ready for utilization in high volume manufacturing (HVM). The EVG120 provides users with an elaborate set of benefits that is simply not found in any other tool and guarantees the highest quality standards in various fields of application at a remarkably low cost of ownership.

EVG120

The EVG501 is a versatile and flexible wafer bonding system, capable of handling substrate sizes ranging from single chips to 150 mm (200 mm with a 200 mm bond chamber). It supports various wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding. The system's design allows for easy access to the bond chamber and tooling, enabling quick and straightforward retooling for different wafer sizes and processes. With a conversion time of less than 5 minutes, the EVG501 offers efficient and seamless transitions between different bonding applications, making it an ideal solution for diverse wafer bonding needs.

EVG501

The EVG®510 is a semi-automated wafer bonding system that is versatile and quick to adapt. It can accommodate various substrate sizes, ranging from pieces to 200 mm. It is compatible with all standard wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct. Its design allows for swift retooling for different wafer sizes and processes, with a conversion time of less than 5 minutes.

Wafer Bonder

EVG510

"The IQ Aligner allows for imprint processes with stamps and wafers from 150 mm to 300 mm diameter. The tool’s
configuration for nanotechnology applications can include stamp release mechanisms and programmable contact force
capability. A temperature controlled chuck for large substrates provides unmatched stamp to substrate overlay accuracy.
Uniform contact force for high yield large area printing is provided by EVG's proprietary chuck design which supports both
soft and hard stamps. The IQ Aligner can be used for micromolding processes for the fabrication of optical elements."

IQ ALIGNER

The fully automated temporary bonding system achieves the whole temporary bonding process – starting with temporary adhesive application, baking, alignment and bonding of the device wafer to the carrier wafer – within one automated tool. The equipment layout is modular as with all of EVG’s fully automated tools, meaning it can be throughput-optimized depending on the specific process. The optional inline metrology module allows total process monitoring and parameter optimization with feedback loops. Because of EVG’s open platform, different types of temporary bonding adhesives can be used, such as spin coat thermoplast, thermoset materials, or tapes.

Wafer Bonder

EVG850 TB

The EVG520-IS is a semi-automated wafer bonding system developed by EV Group (EVG). It is designed to handle wafers up to 200 mm in size, making it suitable for small-volume-production applications. The system's design has been improved based on customer feedback and EV Group's continuous technological innovations. One of its key features is the proprietary symmetric rapid heating and cooling chuck design, which ensures efficient and precise bonding processes. The EVG520-IS offers independent top- and bottom-side heaters, enabling high-pressure bonding capability and providing excellent material and process flexibility. 

 EVG520IS

Substrate / Wafer parameters: 
50 – 150 mm
150 – 200 mm 
200 – 300 mm

Wafer Bonder

SMARTVIEW

The EVG301 semi-automated single wafer cleaning system employs one cleaning station, which cleans wafers using standard DI-water rinse as well as megasonic, brush and diluted chemicals as additional cleaning options. With manual loading and pre-alignment, the EVG301 is a versatile R&D-type system for flexible cleaning procedures and 300 mm capability. The EVG301 system can be combined with EVG's wafer alignment and bonding systems to eliminate any particle prior to wafer bonding. Spinner chucks are available for different wafer and substrate sizes to allow easy setup for different processes.

EVG301

The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.

EVG6200-Infinity

The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography-relevant parameters like critical dimensions, as well as bond alignment accuracy. Because of the system’s high measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters. With its diverse measurement methods, the EVG40 NT adapts to a large number of manufacturing processes like nanoimprint lithography or wafer-to-wafer bonding simultaneously.

EVG40 NT

EVG850 DB Automated Debonding System
Within the fully automated debonder, the processed temporary bonding wafer stack is separated and cleaned, with the fragile device wafer always supported throughout the whole tool. Supported debonding methods include UV laser, thermal and mechanical debonding. With all debonding methods, the device wafer is either supported through film frame mounting or through a thin wafer handler.

EVG850 DB

Double sided alignment system that incorporated high precision back system alignment

EV620

The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.

EVG805


The EVG TBM-8 is a tool designed for non-destructive, double-sided overlay accuracy measurement. It can measure any substrate material up to 8" and is not reliant on infrared. It’s applicable in micro system technology, sensors, micro optics, hybrid technology, multilayers, and any other technology involving critical double-sided lithography.

ТВМ-8

EV501

The EVG810 LT LowTemp™ plasma activation system is a single-chamber, stand-alone unit with manual operation. The process chamber allows for ex-situ processes (wafers are activated one by one and bonded outside the plasma activation chamber).

EVG810 LT

The EVG®6200 NT mask aligner is a versatile tool for optical double-side lithography and wafer sizes up to 200 mm.
Known for its automation flexibility and reliability, the EVG6200 NT provides state-of-the-art mask alignment technology on a minimized footprint area combined with the utmost throughput, advanced alignment features and optimized total cost of ownership. Operator-friendly software, minimized time for mask and tooling changes, as well as efficient worldwide service and support makes it the ideal solution for any manufacturing environment. The EVG6200 NT or the fully-housed EVG6200 NT Gen2 mask alignment systems are available in semi-automated or automated configuration and equipped with integrated vibration isolation to achieve excellent exposure results for a wide range of applications, such as exposure of thin and thick resists, patterning of deep cavities and comparable topographies, as well as processing of thin and fragile materials such as compound semiconductors. Furthermore, the EVG’s proprietary SmartNIL technology is supported on both semi-automated and fully automated system configurations.

EVG6200 NT

AB1-PVS

EV150

EVG820 Lamination System
The EVG820 lamination station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer. This unique lamination technology performs punching of the adhesive tape supplied on a roll, followed by alignment and lamination onto the wafer. The material usually is a double-side adhesive tape. With punching technology, size and dimension of tape are freely selectable and independent from substrate.

EVG820

GEMINI FB Automated Production Wafer Bonding System
Wafer sizes up to 300 mm 

GEMINI FB (Fusion Bond) performs aligned direct bonding at room temperature and ambient pressure conditions. Because the initial bond is formed when the wafers are brought into contact in the aligner, there is no need for bond chambers.  High throughput, best alignment accuracy and small footprint, combined with multiple pre-processing chambers, ensures best performance.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

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