EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

EVGroup (EVG)

EVG520

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• Tooling for 6" and 8” substrates inclusive Bond Chuck and
Pressure Insert
• Capable of fusion compression bonding
• Capable of thermal compression bonding
• Capable of anodic bonding
• Capable of polymer bonding
• Ideal for R&D and pilot production applications
• High-vacuum capable bond chamber
• Auto opening of bond tool cover
• Windows based control software and operation interface
• Wafer size: up to 150mm capable
• Max Bond Force: 10 kN
• Top side heater: 550°C max. in 1°C steps
• Bottom side heater: 550°C max. in 1°C steps
• Temperature uniformity: ± 1,5 %
• Turbo pump and controller
• Roughing pump
• Load/unload tool
• System computer, monitor, and keyboard

• Fully automated processing with manual loading and unloading coupled with external
cooling stations

• Capable of bonding 6 or 8 inch wafers using different bonding mechanisms under
inert atmosphere
• Turbomolecular pumping system & PC-based control
• Programmable recipe editing & automatic data logging
• Chamber vacuum: Pumping down to 1E-3 mbar within 30mins
• Electrical voltage: Up to max. of 2kV
• Bonding stack thickness: Up to 2.5mm

EVG520

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EVGroup (EVG)

EVG520

EVGroup (EVG)

EVG520

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EVGroup (EVG)

EVG520

EVGroup (EVG)

EVG520

EVGroup (EVG)

EVG520

EVGroup (EVG)

EVG520