Overview

EVG 101 Advanced Resist Processing System The EVG101 resist processing system performs R&D-type processes on a single chamber design, which is fully compatible with EVG’s automated systems. The EVG101 supports wafers up to 300 mm and can be configured for spin or spray coating and developing. Conformal layers of photoresist or polymers are achieved on 3D structured wafers for interconnection techniques with EVG’s advanced OmniSpray coating technology. This ensures low material consumption of precious high-viscosity photoresists or polymers while improving uniformity and resist spreading options.