EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

Automated resist processing system providing high-throughput performance and supporting wafers up to 300 mm in diameter

EVGroup (EVG)

EVG150

EVG 101 Advanced Resist Processing System
The EVG101 resist processing system performs R&D-type processes on a single chamber design, which is fully compatible with EVG’s automated systems. The EVG101 supports wafers up to 300 mm and can be configured for spin or spray coating and developing. Conformal layers of photoresist or polymers are achieved on 3D structured wafers for interconnection techniques with EVG’s advanced OmniSpray coating technology. This ensures low material consumption of precious high-viscosity photoresists or polymers while improving uniformity and resist spreading options.

EVG101

The EVG120 universal and fully automated resist processing tool is capable of processing various substrate shapes and sizes up to 200 mm/8". This new generation of the EVG120 comes in a new ultra-compact design with newly developed chemistry cabinet for external storage of chemicals while providing increased throughput capability, optimized for high-volume customer needs and ready for utilization in high volume manufacturing (HVM). The EVG120 provides users with an elaborate set of benefits that is simply not found in any other tool and guarantees the highest quality standards in various fields of application at a remarkably low cost of ownership.

EVG120

EV150

EVG150 XT is an automated resist processing system up to 300mm.

EVG150 XT

Softbake, post-exposure bake and hardbake processes can be performed on the EVG105 bake module. Controlled baking environment assures uniform evaporation. Programmable proximity pins provide the best available control of resist hardening processes and temperature profiles. The EVG105 bake module can process up to 300 mm wafer sizes or up to four 100 mm wafers at the same time.

EVG105

EVG150 N is an automated nanospray coating system up to 300mm.

EVG150 N

EVG105 LA is a large area resist processing system >300mm.

EVG150 LA

EVG101 LA is a large area coating system for >300mm

EVGroup (EVG)

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