Description

Spin coating system with spray coating capability Not used since refurbishment

Configuration

EVG 101 Advanced Spin Coating System consisting of: - MODEL EVG 101 - Semi-Automatic, with Manual loading - Suitable for wafer sizes 3" - 8" wafers (with proper chuck) - Currently configured for 4" & 6" wafers - One Coat Module - Base frame for one resist processing module including all electronics, pneumatics, tubing for solvents, drain or dump container, and exhaust lines - Manual loading and mechanical pre-aligner (pneumatically actuated) - PC controlled with windows based graphical user interface - Password protected access levels - Coat chamber PTFE for Spin Coating - Programmable rotation speed for substrate - Programmable arm for resist dispense and topside EBR - One Cybor Pump - Syringe dispense option included - External Chemical cabinet with two solvents - Previously used chemistry: 1813, 1827, acetone and IPA - Operators Manual and Documentation included Upgrade Chamber to Spray Coating Capability

OEM Model Description

EVG 101 Advanced Resist Processing System The EVG101 resist processing system performs R&D-type processes on a single chamber design, which is fully compatible with EVG’s automated systems. The EVG101 supports wafers up to 300 mm and can be configured for spin or spray coating and developing. Conformal layers of photoresist or polymers are achieved on 3D structured wafers for interconnection techniques with EVG’s advanced OmniSpray coating technology. This ensures low material consumption of precious high-viscosity photoresists or polymers while improving uniformity and resist spreading options.