Description
Semi Automatic, with Manual loadingConfiguration
Wafer diameter: . up to 8 inch (with proper chucks and pre-aligner) . used up to 6 inchOEM Model Description
EVG 101 Advanced Resist Processing System The EVG101 resist processing system performs R&D-type processes on a single chamber design, which is fully compatible with EVG’s automated systems. The EVG101 supports wafers up to 300 mm and can be configured for spin or spray coating and developing. Conformal layers of photoresist or polymers are achieved on 3D structured wafers for interconnection techniques with EVG’s advanced OmniSpray coating technology. This ensures low material consumption of precious high-viscosity photoresists or polymers while improving uniformity and resist spreading options.Documents
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EVGroup (EVG)
EVG101
Verified
CATEGORY
Coaters & Developers
Last Verified: 25 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
108869
Wafer Sizes:
6"/150mm, 8"/200mm
Vintage:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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EVGroup (EVG)
EVG101
CATEGORY
Coaters & Developers
Last Verified: 25 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
108869
Wafer Sizes:
6"/150mm, 8"/200mm
Vintage:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Semi Automatic, with Manual loadingConfiguration
Wafer diameter: . up to 8 inch (with proper chucks and pre-aligner) . used up to 6 inchOEM Model Description
EVG 101 Advanced Resist Processing System The EVG101 resist processing system performs R&D-type processes on a single chamber design, which is fully compatible with EVG’s automated systems. The EVG101 supports wafers up to 300 mm and can be configured for spin or spray coating and developing. Conformal layers of photoresist or polymers are achieved on 3D structured wafers for interconnection techniques with EVG’s advanced OmniSpray coating technology. This ensures low material consumption of precious high-viscosity photoresists or polymers while improving uniformity and resist spreading options.Documents
No documents