Overview

The EVG40 NT2 represents a major breakthrough in metrology performance to meet the new demands for the advanced packaging industry. It provides not only greater overlay accuracy but also a significant boost in throughput to enable higher measurement density per wafer, giving more detailed feedback on hybrid bonding performance, for example. This new metrology solution rounds out EVG’s comprehensive portfolio of process solutions for 3D/heterogeneous integration, and complements our existing EVG40 NT system, which remains the de facto bond metrology standard for MEMS and complex photonic devices. The EVG40 NT2 is already playing a key role in several joint development projects underway at EVG’s Heterogeneous Integration Competence Center™