Overview

EVG 20 IR Inspection System (stand-alone tool) Infrared Inspection Station (integrated module) The EVG20 offers a fast inspection method, especially for fusion bonded wafers. A live image of the entire wafer via IR transmission allows void detection down to a radius of 500 µm which is a perfect match for fusion bonding processes. In addition, the infrared inspection system supports bond strength measurements using the Maszara method.