EVG540 C2W
Category
Wafer BondersOverview
EVG®540 Automated Chip-to-Wafer Bonding System Single chamber production bonder up to 300 mm. Dedicated for chip-to-wafer and wafer-to-wafer bond processes. Unique compliant layer system to compensate chips thickness variations.
Active Listings
0
Services
Inspection, Insurance, Appraisal, Logistics
Top Listings
- No products found