Overview

The IQ Aligner® NT is an automated mask alignment system up to 300mm. It optimized for zero-assist contactless proximity processing at highest throughput. The IQ Aligner NT is the most productive and technically advanced automated mask alignment system for high-volume applications. Featuring the most sophisticated print gab control and zero-assist dual-size wafer processing capability, the system fully addresses high-volume manufacturing (HVM) needs. It provides a 2X increase in throughput and a 2X improvement in alignment accuracy over EVG’s previous-generation IQ Aligner system, giving it the highest throughput of all mask aligners. The IQ Aligner NT surpasses the most demanding requirements for back-end lithography applications while providing up to 30 percent lower cost of ownership compared to competing systems growing out of the highest throughput supported on mask alignment tools.. With advanced wafer alignment run-out control, full-field mask movement capability and high-power UV light source, it is ideally suited for wafer bumping and interposer patterning, thereby serving a variety of advanced packaging types, including wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP), 3D-IC/through-silicon via (TSV), 2.5D interposers, and flip chip.