EVG610
Category
Mask/Bond AlignersOverview
The EVG610 is a versatile lithography system that supports various standard processes including vacuum, hard, soft, and proximity exposure modes, with an added feature of back-side alignment. It also provides extra capabilities such as bond alignment and nanoimprint lithography (NIL). The system is designed for quick processing and easy reconfiguration to meet changing requirements, boasting a conversion time of just a few minutes. Its user-friendly design caters to all skill levels, from beginners to experts, making it an excellent choice for universities and R&D applications.
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