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6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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DISCO DFG841
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.
    Documents

    No documents

    DISCO

    DFG841

    verified-listing-icon

    Verified

    CATEGORY
    Wafer Grinding

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    100512


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    DISCO DFG841

    DISCO

    DFG841

    Wafer Grinding
    Vintage: 2000Condition: Parts Tool
    Last Verified14 days ago

    DISCO

    DFG841

    verified-listing-icon
    Verified
    CATEGORY
    Wafer Grinding
    Last Verified: Over 60 days ago
    listing-photo-1f452f7dacc549d4a29e0f7159e1ed81-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    100512


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The Disco DFG841 is designed for device manufacturers and can handle wafers with a maximum diameter of 200mm (ø4"ø8"). It uses a two-wheel grinding process (rough and fine grinding) for low TTV applications. It features a two-spindle, two-chuck table configuration and an advanced vacuum robot arm for thin wafer handling. The robot arm vacuum corrects thin-ground wafers to the required flatness for trouble-free handling. All wafer transportation is conducted in a safe and secure environment. The machine is designed for ease of maintenance and has a lightweight construction.
    Documents

    No documents

    Similar Listings
    View All
    DISCO DFG841

    DISCO

    DFG841

    Wafer GrindingVintage: 2000Condition: Parts ToolLast Verified:14 days ago
    DISCO DFG841

    DISCO

    DFG841

    Wafer GrindingVintage: 0Condition: UsedLast Verified:Over 60 days ago
    DISCO DFG841

    DISCO

    DFG841

    Wafer GrindingVintage: 1998Condition: UsedLast Verified:Over 60 days ago