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LAM RESEARCH / NOVELLUS INOVA
    Description
    DEPO
    Configuration
    Inova 7 Chamber
    OEM Model Description
    The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.
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    verified-listing-icon

    Verified

    CATEGORY
    CVD

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    123711


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
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    LAM RESEARCH / NOVELLUS INOVA

    LAM RESEARCH / NOVELLUS

    INOVA

    CVD
    Vintage: 2012Condition: Used
    Last VerifiedOver 60 days ago

    LAM RESEARCH / NOVELLUS

    INOVA

    verified-listing-icon
    Verified
    CATEGORY
    CVD
    Last Verified: Over 60 days ago
    listing-photo-eec209ce4d724fd0b163a4ad6206eab2-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    123711


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    DEPO
    Configuration
    Inova 7 Chamber
    OEM Model Description
    The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.
    Documents

    No documents

    Similar Listings
    View All
    LAM RESEARCH / NOVELLUS INOVA

    LAM RESEARCH / NOVELLUS

    INOVA

    CVDVintage: 2012Condition: UsedLast Verified:Over 60 days ago
    LAM RESEARCH / NOVELLUS INOVA

    LAM RESEARCH / NOVELLUS

    INOVA

    CVDVintage: 1999Condition: UsedLast Verified:Over 60 days ago
    LAM RESEARCH / NOVELLUS INOVA

    LAM RESEARCH / NOVELLUS

    INOVA

    CVDVintage: 2012Condition: UsedLast Verified:Over 60 days ago