The Applied Materials Precision 5000 CVD is a single system solution for depositing high-quality, low-temperature dielectric materials on semiconductor devices. It incorporates multi-step processes to provide enabling technology for void-free intermetal dielectric deposition with profile control. The system’s process flexibility over a wide range of applications reduces the number and types of machines required for CVD. This makes it an efficient and cost-effective solution for semiconductor manufacturing.

Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

APPLIED MATERIALS (AMAT)

P5000 CVD

VERSALINE system models are configured to perform an array of etch and deposition processes. Ion beam technology suits a range of applications, from low, controllable damage etching to high-rate, high-aspect-ratio, deep silicon etching to difficult materials. The systems support process control through EndpointWorks®. Enhancements include data logging, automated maintenance scheduler (AMS), and SECS/GEM. Our Cortex® control system provides a stable, user-friendly control interface designed for efficiency and productivity. The VERSALINE platform’s modular design allows for flexible configuration of substrate handling for a variety of handling options, from R&D single wafer or carrier loading with a loadlock to high-volume, multi-chamber production clusters. Clear upgrade paths that leverage costs and process development make future planning easy. 

Plasma-Therm is a global manufacturer of plasma etch, deposition, and advanced packaging equipment for the specialty semiconductor and nanotechnology markets.

PLASMA-THERM

VERSALINE CVD

The Watkins Johnson (WJ) WJ-1000 is an advanced chemical vapor deposition (APCVD) system specifically designed for high productivity in 200mm wafer processing lines. It offers two processing options: hybrid or TEOS-reactant processes. The system is capable of both doped and un-doped deposition of TEOS-based silicon dioxide, providing excellent flexibility for a wide range of dielectric film applications in various semiconductor manufacturing processes. 

AVIZA / WATKINS-JOHNSON

WJ-1000

The WJ-999 is a product from Watkins Johnson. It is an Atmospheric Pressure CVD with 3 process chambers for TEOS and hydride processes. It is used for depositing doped or undoped silicon dioxide (SiO2) films, created from either the TEOS/Ozone or Silane/Oxygen CVD reaction.

CVD

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P5000 CVD

VERSALINE CVD

WJ-1000

WJ-999