Description

NOVELLUS INOVA CUSEED

Configuration

CU SEED CIM - GEM Main System - Mainframe Factory Interface - (QTY 2) SMIF Handler System - (QTY 2) Robot

OEM Model Description

The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.

Documents

No documents

LAM RESEARCH / NOVELLUS

INOVA

Verified

CVD

Last Verified: 6 days ago

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

151296

Wafer Sizes:

8"/200mm

Vintage:

2002

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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