Description

TFM_Cu Barrier Seed_Novellus , CH1 - HCM Cu ALP (2%Mn), CH3 - HCM Ta IONX, CH4 - Cool station, CH5 - HCM Ta IONX, CH7 - HCM Cu AS (2%Mn))

Configuration

No Configuration

OEM Model Description

The INOVA system, which is in the final stages of its development, is an advanced PVD system that delivers Maxfill aluminum and superior Ti/Ti-nitride film quality with excellent particle performance. Maxfill is an innovative, low-pressure, low-k compatible process for aluminum via fill. The Ti/TiN process is in production with Controlled Divergence Technology (CDS). The INOVA is a multi-chamber single wafer processing system. INOVA(TM) Tantalum films are designed to enable barriers for copper metallization.

Documents

No documents

LAM RESEARCH / NOVELLUS

INOVA

Verified

CVD

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

128077

Wafer Sizes:

12"/300mm

Vintage:

Unknown

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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