ACCRETECH next generation systems support optimum device productions.

ACCRETECH / TSK UF 200AL is the Probers system. The UF 200AL can produce wafer size of 5”-8”.

ACCRETECH / TSK

UF200AL

SS30

PG300

It has a newly developed XY stage drive unit and a new calculation procedure for a very high throughput. It also has an improved Z-platform for the highest probe power, which allows for even contact on high pin count probe cards with large surfaces. Additionally, it has a highly stable Z-axis with a large surface spindle cleaning unit and a 15 inch LCD touch screen for easy operation. The Optical Target Scope (OTS) allows for very precise measurements of the relative positions of Probe Cards and Chucks. The UF3000EX-HS is designed for high-speed testing and offers advanced features to enhance productivity and accuracy.

UF3000EX-HS

UF190

ML200

The FP200A is a probing machine made by ACCRETECH / TSK. It performs precision measurement using their unique correction technology on cut wafer, package and such that are attached to the dicing frame. It is a multi-functional prober which performs transfer and testing on a frame as well as wafer of 5 to 8 inches with only one click of button. Some of the features of the FP200A probing machine include: It performs precision measurement using ACCRETECH’s unique correction technology on cut wafer, package and such that are attached to the dicing frame. It is a multi-functional prober which performs transfer and testing on a frame as well as wafer of 5 to 8 inches with only one click of button. Optimization of correction value is realized by the application software which is the outcome of the well-accumulated experiences of 15 years since the release of the frame transfer prober.

FP200A

HRG300

AL300P

AP3000

The FP2000 is a probing machine made by ACCRETECH / TSK. It performs precision measurements using their unique correction technology on cut wafers, packages and such that are attached to the dicing frame. It is a multi-functional prober that performs transfer and testing on a frame as well as wafers of 5 to 8 inches with only one click of a button.

FP2000

ML200Plus

ML300PlusX-FHWH

HRG3000RMX

ML300

ML300Plus-WH

ML300Plus-FH

Most significant machine model for 200mm wafers High precision, high rigidity machine.

UF200SFL

ML300Plus-FHWH

PS300

ACCRETECH/TSK UF190A Probers are high-performance semiconductor testing equipment used in the fabrication and quality control of semiconductor devices. They offer precision, reliability, and automation features to meet the demanding requirements of the semiconductor industry.

UF190A

AD3000T-HC PLUS

ML300EX

Compatible with 200 / 150 / 100 mm size wafer.

ChaMP 232

AP3000e

AltaPlov

Stand-alone wafer cleaning unit, A-CS-300 provides best solution for cleaning and drying the wafer cut by semi-automatic dicing saws. Air accelerated water nozzle and horizontal swing arm achieves excellent cleaning quality.

A-CS-300

A-WD-75A

ChaMP 332

SS10 

Accretech prober with high-speed probing that targets non-memory device

UF 3000 OMEGA

ML301EX-WH

A-WD 300TLDP

HRG200X

ML300PlusX-RM

ML300Plus-RM

PG200RM

The ACCRETECH / TSK UF 200H is a Prober system. The TSK UF 200H can be used with 5”-8” wafer sizes. It has XY Position accuracy and pin to pad alignment. This system has fail mark inspection, needle alignment, and auto needle height setting.

UF200H

ML300EX-FH

PG3000RM

ML300-RM

This prober is specially designed for general logic devices, not only inherits the basic concept of UF200, but also further adopts the latest architecture. It can perform transfer and probe testing of 5 to 8 inch wafers. Use the same MMI as the UF2000. Multiple options to achieve all non-industry standard types of wafer probes.

UF200R

AD3000T-PLUS 

SS20

PS280

The ACCRETECH / TSK UF200DR is a Prober system. The UF200DR can be used with 200mm wafer sizes. 

UF200DR

HRG300A

Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in massproducing.

PG3000RMX

ML300PlusX-WH

ML300EX-FHWH

ML300EX-WH

8-inch Fully Automatic Dicing Machine
Achieved smallest footprint possible utilizing our own core technology

AD2000T

ACC300

MHF6000

The UF3000 is a fully automatic, ultra-high function probing machine developed by ACCRETECH / TSK to be the de facto standard model for the semiconductor testing process. It meets a wide range of customer requirements, including high-mix low-volume production for System LSI and mass production for memories. The machine has received high evaluation from major device manufacturers in terms of CoO (Cost of Ownership) and OEE (Overall Equipment Efficiency).

UF3000

Highly efficient, High throughput, wafer and CSP handling machine.

UF200

ACCRETECH Twin Dicer Series
Full-Automatic Wafer Dicing Machine

A-WD-200T

UF200A

The ACCRETECH / TSK UF 3000EX is a Final Test system. The TSK UF 3000EX can be used with an 8”-12” wafer size with hot chuck.

UF3000EX

High-precision XYZ control system with minimum footprint and high throughput, Multiple operation mode(manual, semi-auto, lull-auto} 

UF60

ACCRETECH / TSK UF 200SA is a Probers system. The UF 200SA can produce wafer size of 8".

UF200SA

MHF300L

A-WD-5000A	

300mm Framed wafer & CSP handling machine.

FP3000

A-WD 300T

WIN-WIN 50-1600

A-WD-10A

A-WD-300TX

Optimized spacing by utilizing all components and optional unit well within the compartment
Standard Spindles up to 60,000 rpm
(80,000 rpm as optional)
Enhanced throughput
①X axis 1,000 mm/sec, Y axis 300 mm/sec, and Z axis 80 mm/sec
②Two Optical Cutter-Set units
③The Worlds’ smallest blade-to-blade distance
17” LCD touch panel and new GUI
GUI（Graphical User Interface)　with simple layout and large touch-buttons allow users’ interactive operation
Easy and simple Kerf check function
(AI kerf check function)
Over 10,000 recipes storable
USB port as standard
(USB memory device can be used as external memory)
Ease-of-maintenance
Wide maintenance door and front-side accessibility allows easy of routine maintenance
Optimized vacuum controller
Reduces 50% of air consumption compared with existing model

AD3000T

Sharing the basic architecture with the UF3000EX, this prober provides high cost efficiency. In order to obtain positioning accuracy efficiently, high hardness of each part is very important. The UF3000 uses the new technology of the Z-axis four-axis drive mechanism (QPU), so it can achieve high hardness and stable probe contact.


UF3000EX-e

5 Microns / 0.2 mil (± 2.5 microns)
4,5, 6, and 8 inch


A-PM-90A

It is the prober with high-speed probing that targets non-memory device. High-speed and low-vibration are realized by adopting the newly developed exclusive XY driving system. Compared with the existing products, it achieved the small footprint by design change and reduction of power consumption by 10% in consideration for environment.

UF3000LX

Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in massproducing. The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table.

PG300RM

A-WD-100A

ACCRETECH / TSK UF200S is a probing machine used for electrical testing of each chip on a wafer, ensuring the quality of semiconductor devices.

UF200S

TIGER/WW50 1600

WIN WIN 50

WIN-WIN 50 A5000

ACCRETECH / TSK UF2000 is a probers system. The TSK UF2000 can be used with a 5”-8” wafer size.

UF2000

The UF3000 is a fully automatic, ultra-high function probing machine developed by ACCRETECH-TOKYO SEIMITSU to be the de facto standard model for the semiconductor testing process. It accurately meets a range of customer requirements including high-mix low-volume production for System LSI etc. or mass production for memories etc.

UF300A

A-WD-100M

SURFCOM 578A

A-WD-250S

E MF1000 100

ACCRETECH / TSK UF 300 is a Probers system. The UF 300 can produce wafer size of 8”- 12”.

UF300

SURFCOM 590A-64

Most significant machine model for 200mm wafers
High precision, high rigidity machine.



UF200A/AL

A-WS-100B

Stand-alone wafer cleaning unit, A-CS-1OOA will provide best solution for cleaning and drying the wafer such as sawn with semi-automatic dicing saws. High-pressure water spray up to 10 MPa driven by horizontal swinging arm will achieve excellent cleaning quality.
■ Maximum rotation speed of spinning table is up to 3,000 min-1
■ Available frame size: 5 to 8"
■ Cleaning method: High-pressure
Rinse Air dry (Driven by swing arm)

A-CS-100A

UF3000EX-f

A-WD-10B

E-ST-VS21A-1

ACCRETECH / TSK FP200 Probers are a type of probing machines that perform electrical tests of each chip on a wafer, ensuring the quality of semiconductor devices. They can handle both framed wafers and CSPs (chip scale packages) with high precision and speed. They can also test wafers of 5 to 8 inches with only one click of button.

ACCRETECH / TSK

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