ACCRETECH next generation systems support optimum device productions.

ACCRETECH / TSK

AP3000e

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AP3000e Prober for T5377 w.cold ARTS-LC12 w.HS3 chiller w.Hinge MHF6000EX w.APC

TSK AP3000e Automatic Wafer Probing System with Single FOUP Unit (8 and 12 inch wafers)

Custom Head Plate for Teradyne ETS-200T
Air Cooled 15-200 degree C Chuck AC12-200 (15°C to 200°C Temperature Range)
Three Fixed Trays and One Inspection Tray
Loader Cover
Chuck Temperature Stability Shield
Wafer ID Recognition Option - Type 6 Topside OCR
Needle-Cleaning Option - Ceramic Cleaning Block (160mm x 280mm)
With Touch Sensor
Probe Mark Inspection Option. Multi-Site Parallel Probing Option (max 2048-site parallel probing)
Soak Time Option
GP-IB Interface Option and Cable (Accretech standard commands)
Light Vega Network Management Option
Ethernet Interface Option
Device Commander Option
RFID for FOUP and Probe Card
EMO Harness
Button Mask Function

AP3000e

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ACCRETECH / TSK

AP3000e

ACCRETECH / TSK

AP3000e

ACCRETECH / TSK

AP3000e

ACCRETECH / TSK

AP3000e

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