Description
TSK AP3000e Automatic Wafer Probing System with Single FOUP Unit (8 and 12 inch wafers) Custom Head Plate for Teradyne ETS-200T Air Cooled 15-200 degree C Chuck AC12-200 (15°C to 200°C Temperature Range) Three Fixed Trays and One Inspection Tray Loader Cover Chuck Temperature Stability Shield Wafer ID Recognition Option - Type 6 Topside OCR Needle-Cleaning Option - Ceramic Cleaning Block (160mm x 280mm) With Touch Sensor Probe Mark Inspection Option. Multi-Site Parallel Probing Option (max 2048-site parallel probing) Soak Time Option GP-IB Interface Option and Cable (Accretech standard commands) Light Vega Network Management Option Ethernet Interface Option Device Commander Option RFID for FOUP and Probe Card EMO Harness Button Mask FunctionConfiguration
HARDWARE COMPONENTS: - Main Control System - Hard Disk Drive - USB Drive - Head Stage - One Single FOUP Port for 25 Wafers (8 to 12 Inch Wafers) - Manual Wafer Inspection Transfer Unit - Dual Robotic Wafer Transport Arms - Pre-Alignment Stage Unit - Advanced Wafer Alignment Unit - Dual (X & Y) Heidenhain Scale - Quad-Pod Z Stage - Color LCD Control Panel with Touch Panel Switches - Alarm Lamp Pole (Blue/Orange/Green) SOFTWARE COMPONENTS: - Automatic Probe to Pad Alignment - Automatic Needle Height Alignment - Tester Communications (TTL) Port - Multi-Site Parallel Probing for 2 Sites - Sample Die Probing - Real-time Color Wafer MapOEM Model Description
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ACCRETECH / TSK
AP3000e
Verified
CATEGORY
Probers
Key Item Details
Condition:
New
Operational Status:
Unknown
Product ID:
89683
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TSK
AP3000e
Verified
CATEGORY
Probers
Last Verified: Over 60 days ago
Key Item Details
Condition:
New
Operational Status:
Unknown
Product ID:
89683
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
TSK AP3000e Automatic Wafer Probing System with Single FOUP Unit (8 and 12 inch wafers) Custom Head Plate for Teradyne ETS-200T Air Cooled 15-200 degree C Chuck AC12-200 (15°C to 200°C Temperature Range) Three Fixed Trays and One Inspection Tray Loader Cover Chuck Temperature Stability Shield Wafer ID Recognition Option - Type 6 Topside OCR Needle-Cleaning Option - Ceramic Cleaning Block (160mm x 280mm) With Touch Sensor Probe Mark Inspection Option. Multi-Site Parallel Probing Option (max 2048-site parallel probing) Soak Time Option GP-IB Interface Option and Cable (Accretech standard commands) Light Vega Network Management Option Ethernet Interface Option Device Commander Option RFID for FOUP and Probe Card EMO Harness Button Mask FunctionConfiguration
HARDWARE COMPONENTS: - Main Control System - Hard Disk Drive - USB Drive - Head Stage - One Single FOUP Port for 25 Wafers (8 to 12 Inch Wafers) - Manual Wafer Inspection Transfer Unit - Dual Robotic Wafer Transport Arms - Pre-Alignment Stage Unit - Advanced Wafer Alignment Unit - Dual (X & Y) Heidenhain Scale - Quad-Pod Z Stage - Color LCD Control Panel with Touch Panel Switches - Alarm Lamp Pole (Blue/Orange/Green) SOFTWARE COMPONENTS: - Automatic Probe to Pad Alignment - Automatic Needle Height Alignment - Tester Communications (TTL) Port - Multi-Site Parallel Probing for 2 Sites - Sample Die Probing - Real-time Color Wafer MapOEM Model Description
None ProvidedDocuments
No documents