ACCRETECH next generation systems support optimum device productions.

The UF3000 is a fully automatic, ultra-high function probing machine developed by ACCRETECH / TSK to be the de facto standard model for the semiconductor testing process. It meets a wide range of customer requirements, including high-mix low-volume production for System LSI and mass production for memories. The machine has received high evaluation from major device manufacturers in terms of CoO (Cost of Ownership) and OEE (Overall Equipment Efficiency).

ACCRETECH / TSK

UF3000

The Accretech UF200 Wafer probing machine is a highly advanced tool with a capacity of 2000 pins. It utilizes Moire scale in the AC servo motor closed-loop control system to achieve fast and precise positioning, boasting a stage accuracy of 2 µm. This machine represents a significant advancement in wafer probing technology, offering users efficient and accurate performance for their probing needs.

UF200

The ACCRETECH / TSK UF200A is a probing machine used for wafer and CSP handling. It is a highly efficient, high throughput machine that offers better cost performance. It can perform transfer and testing on 5 to 8 inch wafers and has a variety of options for all kinds of wafer tests.

UF200A

The Accretech UF3000EX is a fully automatic wafer prober for the highest production requirements. It is now even quicker and more precise, with an extremely high throughput and highest probe power. It also has an optical measurement system and very precise navigation.

UF3000EX

The A-PM-90A Series is an 8-inch full-auto machine designed for high precision and high rigidity. It is specifically designed for memory and logic devices, which are becoming increasingly miniaturized and multi-pin. The machine features an automatic needle matching function, among other features, making it ideal for unmanned line construction. Additionally, the A-PM-90A Series boasts high throughput and cleanliness handling, ensuring efficient and reliable operation. 

A-PM-90A

The UF3000EX-e is a fully automatic wafer prober that is also available for numerous special applications. It is uncompromising for throughput, very flexible for application, and has very precise navigation. It uses non-contact measurement and can handle wafers from 200 to 300 mm in diameter, including special types of wafers. The UF3000EX-e features a newly developed XY stage drive unit and a new algorithm for extremely high throughput, an improved Z-platform for the highest probe power, and a 15-inch LCD touch screen for easy operation. It also has an Optical Target Scope (OTS) for very precise measurements of the relative positions of probe cards and chucks, a tri-color 3-level magnifying function for color recording and 3 enhancement levels, and a navigation display function that allows the user to manage each desired wafer point by simply touching the wafer map.

UF3000EX-e

ACCRETECH / TSK UF 200SA is a Probers system. The UF 200SA can produce wafer size of 8".

UF200SA

High-precision XYZ control system with minimum footprint and high throughput, Multiple operation mode(manual, semi-auto, lull-auto} 

UF60

The ACCRETECH / TSK UF3000LX is a probing machine that performs electrical tests of each chip on a wafer, ensuring the quality of semiconductor devices. It is a prober with high-speed probing that targets non-memory devices. High-speed and low-vibration are achieved by adopting the newly developed exclusive XY driving system. Compared with existing products, it has a smaller footprint due to design changes and has reduced power consumption by 10% in consideration for the environment.

UF3000LX

The ACCRETECH / TSK UF2000 is a probing machine for 200mm wafers. It is a high precision, high rigidity machine that offers a variety of options for wafer test. Some of the options include testing environments that can adopt from ultrahigh to low temperature, transfer of warpage and ultrathin wafer by the special transfer mechanism, and a low noise testing environment.

UF2000

DH-150	

Wafer probers are used in the semiconductor industry to test and measure electrical characteristics of integrated circuits (ICs) on wafers before they are packaged. The UF190B is typically used in research and development, quality control, and production testing of ICs.

UF190B

ACCRETECH / TSK UF200S is a probing machine used for electrical testing of each chip on a wafer, ensuring the quality of semiconductor devices.

UF200S

A-PM-60B

MHF300L

This prober is specially designed for general logic devices, not only inherits the basic concept of UF200, but also further adopts the latest architecture. It can perform transfer and probe testing of 5 to 8 inch wafers. Use the same MMI as the UF2000. Multiple options to achieve all non-industry standard types of wafer probes.

UF200R

The ACCRETECH / TSK UF200AL is a probing machine for 200mm wafers. It is a high precision, high rigidity machine that offers improved precision and throughput. It also has a variety of options for all kinds of wafer tests that are not standard in the industry.

UF200AL

UF190R

 UF300 is a state-of-the-art device that is ready for volume production of 300 mm lines. It is capable of producing large quantities of 300 mm lines, making it an ideal choice for high-volume manufacturing operations.

UF300

AP3000e

MHF300S	

The FP2000 is a probing machine made by ACCRETECH / TSK. It performs precision measurements using their unique correction technology on cut wafers, packages and such that are attached to the dicing frame. It is a multi-functional prober that performs transfer and testing on a frame as well as wafers of 5 to 8 inches with only one click of a button.

FP2000

Most significant machine model for 200mm wafers High precision, high rigidity machine.

UF200SFL

The FP3000 is a probing machine manufactured by ACCRETECH. It is a 300mm framed wafer & CSP handling machine that performs precision measurement using their unique correction technology on cut wafer, package and such that are attached to the dicing frame. It is a multi-functional prober that performs transfer and testing on a frame as well as wafer with only one click of button by optional function.

FP3000

MHF400R

MHF600

UF3000EX-f

MHF410

MHF4000

MHF6000

UF190 is a high-speed product that offers a high cost-performance ratio. This means that it provides excellent performance and speed at a reasonable cost, making it a great value for its price.

UF190

UF200FL is a Probers Machine that is equipped with a temperature control unit and two auto needles for height alignment and position alignment. It also comes equipped with its self needle cleaning units, profile sensors.

UF200FL

A-PM-90AF

AP3000

A-PM-90V

The ACCRETECH / TSK UF 200H is a Prober system. The TSK UF 200H can be used with 5”-8” wafer sizes. It has XY Position accuracy and pin to pad alignment. This system has fail mark inspection, needle alignment, and auto needle height setting.

UF200H

ACCRETECH / TSK FP200 Probers are a type of probing machines that perform electrical tests of each chip on a wafer, ensuring the quality of semiconductor devices. They can handle both framed wafers and CSPs (chip scale packages) with high precision and speed. They can also test wafers of 5 to 8 inches with only one click of button.

FP200

The ACCRETECH / TSK UF200A/AL is a wafer prober1. It is the most significant machine model for 200mm wafers and is known for its high precision and high rigidity.

UF200A/AL

UF200SA/FL

MHF4000S

MHF9000EX

The Wafer Probing Machine UF300A is a highly advanced equipment designed for wafer probing processes. It offers precise stage-positioning capabilities with an accuracy of 2 micro-meters and is compatible with wafers of ø 300 mm in size. The machine features a Z-theta stage that provides super-high rigidity, ensuring stability during probing operations.

UF300A

A-PM-90A-N

ACCRETECH/TSK UF190A Probers are high-performance semiconductor testing equipment used in the fabrication and quality control of semiconductor devices. They offer precision, reliability, and automation features to meet the demanding requirements of the semiconductor industry.

UF190A

It has a newly developed XY stage drive unit and a new calculation procedure for a very high throughput. It also has an improved Z-platform for the highest probe power, which allows for even contact on high pin count probe cards with large surfaces. Additionally, it has a highly stable Z-axis with a large surface spindle cleaning unit and a 15 inch LCD touch screen for easy operation. The Optical Target Scope (OTS) allows for very precise measurements of the relative positions of Probe Cards and Chucks. The UF3000EX-HS is designed for high-speed testing and offers advanced features to enhance productivity and accuracy.

UF3000EX-HS

A-PM-88A

The FP200A is a probing machine made by ACCRETECH / TSK. It performs precision measurement using their unique correction technology on cut wafer, package and such that are attached to the dicing frame. It is a multi-functional prober which performs transfer and testing on a frame as well as wafer of 5 to 8 inches with only one click of button. Some of the features of the FP200A probing machine include: It performs precision measurement using ACCRETECH’s unique correction technology on cut wafer, package and such that are attached to the dicing frame. It is a multi-functional prober which performs transfer and testing on a frame as well as wafer of 5 to 8 inches with only one click of button. Optimization of correction value is realized by the application software which is the outcome of the well-accumulated experiences of 15 years since the release of the frame transfer prober.

FP200A

The ACCRETECH / TSK UF200DR is a Prober system. The UF200DR can be used with 200mm wafer sizes. 

UF200DR

MHF400

Accretech prober with high-speed probing that targets non-memory device

UF 3000 OMEGA

AltaPlov

High-precision XYZ control system with minimum footprint and high throughput This machine provides excellent operability by color liquid crystal touch panel and compliant with optical device and high luminance LED measurement. 

UF50

The UF200D is a machine that features parallel processing with dual-stages. This allows for efficient and simultaneous processing of multiple tasks, resulting in increased productivity and faster completion times. 

ACCRETECH / TSK

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