A-WD-10A
Category
Scribing, Cutting, DicingOverview
The A-WD-10A is a compact wafer dicing machine capable of dicing wafers up to 160 mm square in size. It features a smooth grinding feed and a high reliability power spindle, making it a reliable and efficient choice for your wafer dicing needs.
Active Listings
6
Services
Inspection, Insurance, Appraisal, Logistics
Top Listings
- ACCRETECH / TSKA-WD-10AScribing, Cutting, DicingVintage: 2001Condition: UsedLast VerifiedOver 60 days ago
- ACCRETECH / TSKA-WD-10AScribing, Cutting, DicingVintage: 2001Condition: UsedLast VerifiedOver 60 days ago
- ACCRETECH / TSKA-WD-10AScribing, Cutting, DicingVintage: 2001Condition: UsedLast VerifiedOver 60 days ago
- ACCRETECH / TSKA-WD-10AScribing, Cutting, DicingVintage: Condition: UsedLast VerifiedOver 60 days ago
