A-WD-10A
Category
Scribing, Cutting, DicingOverview
The A-WD-10A is a compact wafer dicing machine capable of dicing wafers up to 160 mm square in size. It features a smooth grinding feed and a high reliability power spindle, making it a reliable and efficient choice for your wafer dicing needs.
Active Listings
3
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ACCRETECH / TSK
A-WD-10A
Scribing, Cutting, DicingVintage: 2001Condition: UsedLast VerifiedOver 60 days agoACCRETECH / TSK
A-WD-10A
Scribing, Cutting, DicingVintage: 2001Condition: UsedLast VerifiedOver 60 days agoACCRETECH / TSK
A-WD-10A
Scribing, Cutting, DicingVintage: 2001Condition: UsedLast VerifiedOver 60 days ago
