Description
AUTOMATIC DICNG SAWConfiguration
No ConfigurationOEM Model Description
The A-WD-10A is a compact wafer dicing machine capable of dicing wafers up to 160 mm square in size. It features a smooth grinding feed and a high reliability power spindle, making it a reliable and efficient choice for your wafer dicing needs.Documents
No documents
ACCRETECH / TSK
A-WD-10A
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
69279
Wafer Sizes:
Unknown
Vintage:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ACCRETECH / TSK
A-WD-10A
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
69279
Wafer Sizes:
Unknown
Vintage:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
AUTOMATIC DICNG SAWConfiguration
No ConfigurationOEM Model Description
The A-WD-10A is a compact wafer dicing machine capable of dicing wafers up to 160 mm square in size. It features a smooth grinding feed and a high reliability power spindle, making it a reliable and efficient choice for your wafer dicing needs.Documents
No documents