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    Key Item Details


    Operational Status:

    Product ID:96284

    Wafer Sizes:Unknown



    (1) Main frame; 140×180×225(H); 1795kg (1) Explorer machine; 180×225×210(H); 1250kg (1) 2x Loadport; 180×225×130(H); 438kg


    low-k wafer grooving 12 in wafer film frame (adjustable from 8 to 12”): Yes Metal chuck It has a barcode scanner for recipe loading Damaged Part: CM Motor

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    OEM Model Description

    The DFL7160 is a fully automatic laser saw that is compatible with 300 mm wafers. It uses a pulse laser to achieve non-thermal processing and supports various applications, including full cut and DAF cut. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. To prevent wafer contamination from laser processing particles, the DFL7160 can be equipped with the HogoMax coating/cleaning mechanism, which is a water-soluble protective film that prevents laser processing particles from adhering to the wafer surface. This makes the DFL7160 a versatile and reliable tool for wafer processing.

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