The P-12XL Prober is a next-generation prober developed by TEL. It builds on the success of the P-8XL and shares the same interactive LCD Touch Panel Screen and On-axis Alignment. Additionally, it incorporates a FOUP loader, increased Z force, and higher accuracy, making it capable of tackling tomorrow’s technological challenges. The P-12XL has even been featured in the Semiconductor International article “Fabrication of the First Transistors on 300mm Wafers.

TEL / TOKYO ELECTRON

P-12XL

The P-8 is a high-precision machine that offers superior operability, efficiency, and space conservation. It is capable of handling 4, 5, 6, and 8 inch wafers and is comprised of two main units: the probing unit and the loading unit. The probing unit includes high precision X, Y, Z, and theta stages, while the loading unit supplies wafers from cassettes to the probing unit. With its advanced features, the P-8 is able to achieve high accuracy in its operations. 

The P-8XL Prober is a market innovation in the wafer probing industry by TEL. It offers superior accuracy, reliability, efficiency, and integration for the test cell through its features such as on-axis alignment, optical wafer profiling, and direct test head docking. The P-8XL is equipped with a fully interactive LCD Touch Panel Screen and TEL’s advanced On-Axis Alignment System, delivering guaranteed pin-to-pad accuracy. It also offers a range of features to overcome probe floor barriers, including Direct Coupling Test Interfaces, Automatic Probe Card Changers, Clean Air Management Systems, Temperature Controlled Chucks, and many others. With its advanced capabilities, the P-8XL is ready to meet the demands of future device complexity and measurement precision.

P-8XL

The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.

PRECIO

The P-12XLn+ is a next-generation wafer prober developed for 300mm testing. It retains the acclaimed on-axis alignment feature of previous models while being able to handle reduced pad sizes. The system assures high-accuracy probing under both high and low temperature conditions, thanks to its hot and cold temperature, heat dissipation thermal systems. Additionally, the P-12XLn+'s rigid deflection-resistant stage can handle higher pin counts with lower mechanical deflection.

The P-12XLn+ also features an automation system and equipment standardization, as well as clean technology, PC-aided product file management, and remote operation. It is capable of handling CIM/FA, such as AMHS, and is software compatible with the P-8 series probers. The P-12XLn+ is capable of measuring wafer sizes of 300mm, 200mm, and 150mm (option). TEL has also introduced the P12XLm, an improved model of the P-12XLn+, with superior alignment capability.

P-12XLn+

The P-12XLm is an improved model of the P-12XLn+ wafer prober developed by TEL for 300mm testing. It retains the acclaimed on-axis alignment feature of previous models while handling reduced pad size and assuring high-accuracy probing under both high and low temperature conditions. The P-12XLm’s rigid deflection resistant stage can handle higher pin counts with lower mechanical deflection and has superior alignment capability. Other features include an automation system, equipment standardization, a high-accuracy and high-force resistance stage for optimal contact, hot and cold temperature heat dissipation thermal systems, capability of handling CIM/FA such as AMHS, clean technology, PC-aided product file management and remote operation, software compatibility with the P-8 series probers, and measurement capability for 300mm, 200mm, and 150mm (option) wafer sizes.

P-12XLm

The P-12XLn is a next-generation wafer prober developed for 300mm testing. It is part of the P-12XL series, which also includes the P-12XL, P-12XLn+, and P-12XLm models. The P-12XLn retains the acclaimed on-axis alignment feature of previous models while being able to handle reduced pad size. The system assures high-accuracy probing under both high and low temperature conditions, thanks to its hot and cold temperature, heat dissipation thermal systems. Additionally, the P-12XLn’s rigid deflection-resistant stage can handle higher pin counts with lower mechanical deflection. Other features of the P-12XLn include an automation system, equipment standardization, clean technology, PC-aided product file management and remote operation, and software compatibility with the P-8 series probers. The P-12XLn is capable of handling CIM/FA, such as AMHS, and can measure wafer sizes of 300mm, 200mm, and 150mm (option).

P-12XLn

LTI Unit

The WDF DP is a unique device that offers the dual functionality of a wafer prober and a dicing frame handler. It is specifically designed for CSP/WLCSPs, one of the fastest growing markets in recent years. The WDF DP can handle both regular wafers and wafers/substrates on dicing frames, resulting in production efficiency improvement. Additionally, the WDF DP helps reduce testing costs because of its change-over-kit less solution and higher index time as compared with a conventional handler. Some of its key features include wafer and dicing frame handling capability without use of a change-over-kit, over twice the throughput of conventional horizontally moving handler, special alignment available for diced wafers, hot temperature testing (max : 150℃), and flat-top for the large test-head. Overall, the WDF DP is an innovative solution that can help improve production efficiency and reduce testing costs.

WDF DP

The Precio™ XL is the latest 300mm fully automated wafer prober developed by TEL, based on their Precio™ series. This new model offers high productivity, contact performance, cleanliness improvement, and short delivery time, all with the goal of reducing test costs. It is compatible with the wafer parameters of previous Precio™ models and includes several new features such as high-speed probe mark inspection TELPADS™-I, Auto Leveling, and the optional ZOOM-I for stable and soft contact. Additionally, TEL has introduced the CoSMOz software option for more efficient setup file generation and test efficiency. This software can calculate the optimum contact sequence, a task previously performed by customer test engineers. Overall, the Precio™ XL wafer prober is a powerful tool for improving work efficiency and reducing test costs.

PRECIO XL

Precio nano™ is a 300mm wafer prober that realizes high accuracy contact and cleanness under high load. In the probing process, demand for probing technology has diversified as process miniaturization, high function/high integration devices and packages are changing.

PRECIO NANO

Precio octo™ is an 8-inch wafer prober that dramatically increases productivity by using ultra-high-speed indexing and high-speed wafer exchange functions to reduce test costs and improve Cost of Ownership. The structure has been strengthened and major components and optics have been improved to reduce vibration, resulting in superior operation. Additionally, the installation of TELPADS™-I automatic probe mark inspection allows for the assessment of probe card quality and the assurance of probe mark quality

PRECIO OCTO

P-8XLm	

WDF 8

P-12

WDF™ 12DP + is the latest dicing frame prober with a new system platform concept that can handle and test both 300mm wafers and 300mm dicing frames with no change kit.

WDF 12DP+

There are an increasing variety of test requirements in conjunction with diversified device design, device application, process node shrink and package design complexity. To reduce total test cost, especially in Memory applications, multi-site probe cards were introduces as a way of reducing test cost. This method found its limit when single wafer/one-touch-down probe card technology appeared. Cellcia™ is a breakthrough technology. Splitting wafer lots into the Cellcia™ multi-cell probe system, reduces test turn-around-time and improves system footprint by adopting a multi-layer structure. Conventional prober technology cannot achieve the Cellcia™ throughput with similar floor space. The Cellcia™ system maximizes test efficiency and minimizes total test cost. TEL has combined its vast wafer probe experience and front-end process technologies to develop the world’s leading probe system, Cellcia™.

CELLCIA

The WDF 12DP also benefits from the advanced hardware reliability of TELs 300mm Precio series of fully automatic wafer probers. Employing TELs patented On-Axis Alignment and N-Shot alignment feature, the WDF 12DP provides superior accuracy and the ability to test in parallel.

TEL / TOKYO ELECTRON

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