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The P-12XLm is an improved model of the P-12XLn+ wafer prober developed by TEL for 300mm testing. It retains the acclaimed on-axis alignment feature of previous models while handling reduced pad size and assuring high-accuracy probing under both high and low temperature conditions. The P-12XLm’s rigid deflection resistant stage can handle higher pin counts with lower mechanical deflection and has superior alignment capability. Other features include an automation system, equipment standardization, a high-accuracy and high-force resistance stage for optimal contact, hot and cold temperature heat dissipation thermal systems, capability of handling CIM/FA such as AMHS, clean technology, PC-aided product file management and remote operation, software compatibility with the P-8 series probers, and measurement capability for 300mm, 200mm, and 150mm (option) wafer sizes.

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