Overview

This series is a fully automatic wafer-probing platform. Due to process miniaturization, higher device functionality, and package variety, demand for probing technology in the test process is becoming increasingly diversified. The Precio™ series not only has XY accuracy to realize more reliable contacts but also has greater Z-axis control, which is important for soft contact. Optimum temperature control during test, and increased of parallel die testing are achieved with the Precio™ prober series.