Description
No Hard Drive included. May need TEL or third-party support for OS and software installation. Prior owner’s internal policy is to remove hard drives from all their resale equipment before releasing.Configuration
Dual FOUP Interface Wafer size (mm): 200, 300 Stage technology: Linear motor No Hinge Manipulator Temperature Control System SACC FOUP Auto Loader Floppy Disk Drive GP-IB interface Combo Interface Cold Chuck -55C to 150C Chiller TEL model C325, down to -25d C Semi automatic Probe card changerOEM Model Description
The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.Documents
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TEL / TOKYO ELECTRON
PRECIO
Verified
CATEGORY
Probers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
112499
Wafer Sizes:
8"/200mm, 12"/300mm
Vintage:
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
PRECIO
CATEGORY
Probers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
112499
Wafer Sizes:
8"/200mm, 12"/300mm
Vintage:
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No Hard Drive included. May need TEL or third-party support for OS and software installation. Prior owner’s internal policy is to remove hard drives from all their resale equipment before releasing.Configuration
Dual FOUP Interface Wafer size (mm): 200, 300 Stage technology: Linear motor No Hinge Manipulator Temperature Control System SACC FOUP Auto Loader Floppy Disk Drive GP-IB interface Combo Interface Cold Chuck -55C to 150C Chiller TEL model C325, down to -25d C Semi automatic Probe card changerOEM Model Description
The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.Documents
No documents