Description
Software: PSAS (PRECIO Standard Application Software)Configuration
Auto alignment system (Needle tip, wafer) Chuck camera unit-II Bridge camera unit-II Alarm monitor Real time wafer map display Single opener loader Headplate frame: 480 SQ Base headplate adapter: 40 mm Loader type: FOUP Chuck temperature: Hot GPIB I/F STD WAPP Pearl brush LCD Panel standard LAN Network kit Touch pen Top side OCR No chiller Wafer table Direct dock capability Pogo tower with INTEST interfaceOEM Model Description
The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.Documents
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TEL / TOKYO ELECTRON
PRECIO
Verified
CATEGORY
Probers
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
101023
Wafer Sizes:
12"/300mm
Vintage:
2014
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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TEL / TOKYO ELECTRON
PRECIO
CATEGORY
Probers
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
101023
Wafer Sizes:
12"/300mm
Vintage:
2014
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Software: PSAS (PRECIO Standard Application Software)Configuration
Auto alignment system (Needle tip, wafer) Chuck camera unit-II Bridge camera unit-II Alarm monitor Real time wafer map display Single opener loader Headplate frame: 480 SQ Base headplate adapter: 40 mm Loader type: FOUP Chuck temperature: Hot GPIB I/F STD WAPP Pearl brush LCD Panel standard LAN Network kit Touch pen Top side OCR No chiller Wafer table Direct dock capability Pogo tower with INTEST interfaceOEM Model Description
The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.Documents
No documents