Description
Wafer Backside GrinderConfiguration
No ConfigurationOEM Model Description
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.Documents
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DISCO
DGP8761
Verified
CATEGORY
Lapping, Polishing, Grinding
Last Verified: 24 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116270
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DGP8761
CATEGORY
Lapping, Polishing, Grinding
Last Verified: 24 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116270
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Wafer Backside GrinderConfiguration
No ConfigurationOEM Model Description
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.Documents
No documents