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Description
Improve processing stability and achieve higher productivity efficiency Dgp8761 is an improved model of dgp8760 with outstanding global sales performance. The machine realizes the integration of back grinding and residual stress removal technology, and can stably realize the thin machining with thickness less than 25 μ M. The newly developed spindle is also equipped, which is suitable for high-speed grinding and machining. It helps to shorten the processing time of thin wafer (compared with dgp8760). In addition, the reasonable layout of the handling mechanism shortens the production time beyond the processing. Various application of the third spindle The third spindle application for wafer machining includes the following Remove residual stress ● environmental protection, no "dry polishing" with liquid medicine or water ● CMP (special option) Ultra precision grinding (special option) Poligrind ●UltraPoligrindConfiguration
No ConfigurationOEM Model Description
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.Documents
No documents
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
112258
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
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Refurbishment Services
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DISCO
DGP8761
CATEGORY
Lapping, Polishing, Grinding
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
112258
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Improve processing stability and achieve higher productivity efficiency Dgp8761 is an improved model of dgp8760 with outstanding global sales performance. The machine realizes the integration of back grinding and residual stress removal technology, and can stably realize the thin machining with thickness less than 25 μ M. The newly developed spindle is also equipped, which is suitable for high-speed grinding and machining. It helps to shorten the processing time of thin wafer (compared with dgp8760). In addition, the reasonable layout of the handling mechanism shortens the production time beyond the processing. Various application of the third spindle The third spindle application for wafer machining includes the following Remove residual stress ● environmental protection, no "dry polishing" with liquid medicine or water ● CMP (special option) Ultra precision grinding (special option) Poligrind ●UltraPoligrindConfiguration
No ConfigurationOEM Model Description
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.Documents
No documents
Similar Listings
View AllDISCO
DGP8761
Lapping, Polishing, GrindingVintage: 2011Condition: UsedLast Verified:Over 60 days agoPREFERRED