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6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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DISCO DGP8761
    Description
    Improve processing stability and achieve higher productivity efficiency Dgp8761 is an improved model of dgp8760 with outstanding global sales performance. The machine realizes the integration of back grinding and residual stress removal technology, and can stably realize the thin machining with thickness less than 25 μ M. The newly developed spindle is also equipped, which is suitable for high-speed grinding and machining. It helps to shorten the processing time of thin wafer (compared with dgp8760). In addition, the reasonable layout of the handling mechanism shortens the production time beyond the processing. Various application of the third spindle The third spindle application for wafer machining includes the following Remove residual stress ● environmental protection, no "dry polishing" with liquid medicine or water ● CMP (special option) Ultra precision grinding (special option) Poligrind ●UltraPoligrind
    Configuration
    No Configuration
    OEM Model Description
    The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.
    Documents

    No documents

    DISCO

    DGP8761

    verified-listing-icon

    Verified

    CATEGORY
    Lapping, Polishing, Grinding

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    112258


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    DISCO DGP8761

    DISCO

    DGP8761

    Lapping, Polishing, Grinding
    Vintage: 2012Condition: Used
    Last VerifiedOver 30 days ago

    DISCO

    DGP8761

    verified-listing-icon
    Verified
    CATEGORY
    Lapping, Polishing, Grinding
    Last Verified: Over 60 days ago
    listing-photo-cce441aeac2b4df79e1fd5425b548361-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    112258


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Improve processing stability and achieve higher productivity efficiency Dgp8761 is an improved model of dgp8760 with outstanding global sales performance. The machine realizes the integration of back grinding and residual stress removal technology, and can stably realize the thin machining with thickness less than 25 μ M. The newly developed spindle is also equipped, which is suitable for high-speed grinding and machining. It helps to shorten the processing time of thin wafer (compared with dgp8760). In addition, the reasonable layout of the handling mechanism shortens the production time beyond the processing. Various application of the third spindle The third spindle application for wafer machining includes the following Remove residual stress ● environmental protection, no "dry polishing" with liquid medicine or water ● CMP (special option) Ultra precision grinding (special option) Poligrind ●UltraPoligrind
    Configuration
    No Configuration
    OEM Model Description
    The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.
    Documents

    No documents

    Similar Listings
    View All
    DISCO DGP8761

    DISCO

    DGP8761

    Lapping, Polishing, GrindingVintage: 2012Condition: UsedLast Verified:Over 30 days ago
    DISCO DGP8761

    DISCO

    DGP8761

    Lapping, Polishing, GrindingVintage: 0Condition: UsedLast Verified:Over 60 days ago
    DISCO DGP8761

    DISCO

    DGP8761

    Lapping, Polishing, GrindingVintage: 0Condition: NewLast Verified:Over 60 days ago