Description
DGP8761+DFM2800Configuration
Process: Backgrinding Mode: Fully-autoOEM Model Description
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.Documents
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DISCO
DGP8761
Verified
CATEGORY
Lapping, Polishing, Grinding
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116458
Wafer Sizes:
8"/200mm, 12"/300mm
Vintage:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DGP8761
CATEGORY
Lapping, Polishing, Grinding
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116458
Wafer Sizes:
8"/200mm, 12"/300mm
Vintage:
2013
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
DGP8761+DFM2800Configuration
Process: Backgrinding Mode: Fully-autoOEM Model Description
The DGP8761 is the successor to the DGP8760. It integrates backside grinding and stress relief processing and can perform stable thin grinding to a thickness less than 25 µm. The DGP8761 is equipped with a newly developed spindle that supports high-speed grinding, contributing to a shorter thin wafer processing time compared to the DGP8760. Additionally, an optimized handling layout shortens the cycle time, excluding processing time.Documents
No documents