Description
Process: Oxide Etch No HDDConfiguration
TEL Telius SP-305 SCCM ➢ 4 Chambers ➢ 5 Load Ports ➢ Turbo Pumps: Shidmazhu TMP-3403LMC-T4(VG300) (Qty.4) ➢ FOUP Opener: SELOP 12F25-30U-14 ➢ Purge: N2 (Process Grade N2) ➢ Filter: CNF1004USG4 (Nihon Pall) ➢ Regulator: SQMICRO (VERIFLO) ➢ Filter (N2): SQMICRO (VERIFLO) ➢ Valve: Primary side (Utility-MFC): Mega mini (FUJIKIN) ➢ Valve: Secondary side (MFC-PC): Mega one (FUJIKIN) ➢ Piping: Dual Piping (for Gas leak containment, Gas box to Final valve & Exhaust through Gas box) ➢ Gas Leak Detection Port: 5 Ports (6.35mm, Swagelok L-type) ➢ Final Pressure Switch: 51A (MKS) ➢ Pressure Gauge: Bourdon Gauge (with inside finishing) ➢ Pressure Gauge: Bourdon Gauge (with inside finishing) 0.4MPa ➢ SP3 Gas Line Connection: No ➢ Chiller: Shinwa CH2-DC-2T2 Qty. 4 ➢ RF Generator Top: Daihen AGA-50B2 Qty. 4 ➢ RF Generator Bottom: Daihen WGA-50E Qty. 4 ➢ Gas line 1- N2 1000 sccm-AERA FCD985CT-BF ➢ Gas line 2- C4F8 200 sccm-AERA FC-D985CT-BF ➢ Gas line 3- Ar 2000 sccm-AERA FC-D985CT-BF ➢ Gas line 4- O2 50 sccm-AERA FC-D985CT-BF ➢ Gas line 5- CH2F2 100 sccm-AERA FC-D985CT-BF ➢ Gas line 6- CHF3 200 sccm-AERA FC-D985CT-BF ➢ Gas line 7- CF4 200 sccm-AERA FC-D985CT-BF ➢ Gas line 8- C4F8 50 sccm- AERA FC-D985CT-BF ➢ Gas line 9- C3F8 50 sccm- AERA FC-D985CT-BF ➢ Gas line 10- C4F6 50 sccm-AERA FC-D985CT-BF ➢ Gas line 11- O2 1000 sccm-AERA FC-D985CT-BF ➢ Gas line 12- Ar 500 sccm-AERA FC-D985CT-BF ➢ Gas line 13- C4F8 20 sccm-AERA FC-D985CT-BF ➢ Gas line 14- C4F6 20 sccm-AERA FC-D985CT-BF ➢ Gas line 15- HeO2 50 sccm-AERA FC-D985CT-BF ➢ Gas line 16- Ar 100 sccm-AERA FC-D985CT-BFOEM Model Description
Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.Documents
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TEL / TOKYO ELECTRON
TELIUS SP 305 SCCM
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
104265
Wafer Sizes:
12"/300mm
Vintage:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
TELIUS SP 305 SCCM
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
104265
Wafer Sizes:
12"/300mm
Vintage:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Process: Oxide Etch No HDDConfiguration
TEL Telius SP-305 SCCM ➢ 4 Chambers ➢ 5 Load Ports ➢ Turbo Pumps: Shidmazhu TMP-3403LMC-T4(VG300) (Qty.4) ➢ FOUP Opener: SELOP 12F25-30U-14 ➢ Purge: N2 (Process Grade N2) ➢ Filter: CNF1004USG4 (Nihon Pall) ➢ Regulator: SQMICRO (VERIFLO) ➢ Filter (N2): SQMICRO (VERIFLO) ➢ Valve: Primary side (Utility-MFC): Mega mini (FUJIKIN) ➢ Valve: Secondary side (MFC-PC): Mega one (FUJIKIN) ➢ Piping: Dual Piping (for Gas leak containment, Gas box to Final valve & Exhaust through Gas box) ➢ Gas Leak Detection Port: 5 Ports (6.35mm, Swagelok L-type) ➢ Final Pressure Switch: 51A (MKS) ➢ Pressure Gauge: Bourdon Gauge (with inside finishing) ➢ Pressure Gauge: Bourdon Gauge (with inside finishing) 0.4MPa ➢ SP3 Gas Line Connection: No ➢ Chiller: Shinwa CH2-DC-2T2 Qty. 4 ➢ RF Generator Top: Daihen AGA-50B2 Qty. 4 ➢ RF Generator Bottom: Daihen WGA-50E Qty. 4 ➢ Gas line 1- N2 1000 sccm-AERA FCD985CT-BF ➢ Gas line 2- C4F8 200 sccm-AERA FC-D985CT-BF ➢ Gas line 3- Ar 2000 sccm-AERA FC-D985CT-BF ➢ Gas line 4- O2 50 sccm-AERA FC-D985CT-BF ➢ Gas line 5- CH2F2 100 sccm-AERA FC-D985CT-BF ➢ Gas line 6- CHF3 200 sccm-AERA FC-D985CT-BF ➢ Gas line 7- CF4 200 sccm-AERA FC-D985CT-BF ➢ Gas line 8- C4F8 50 sccm- AERA FC-D985CT-BF ➢ Gas line 9- C3F8 50 sccm- AERA FC-D985CT-BF ➢ Gas line 10- C4F6 50 sccm-AERA FC-D985CT-BF ➢ Gas line 11- O2 1000 sccm-AERA FC-D985CT-BF ➢ Gas line 12- Ar 500 sccm-AERA FC-D985CT-BF ➢ Gas line 13- C4F8 20 sccm-AERA FC-D985CT-BF ➢ Gas line 14- C4F6 20 sccm-AERA FC-D985CT-BF ➢ Gas line 15- HeO2 50 sccm-AERA FC-D985CT-BF ➢ Gas line 16- Ar 100 sccm-AERA FC-D985CT-BFOEM Model Description
Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.Documents
No documents