Description
Dielectric EtchConfiguration
<p>Tool is operating in clean room.</p><p> </p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">[Chamber A]</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Chamber type:DRM</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Gas config. (sccm)=FCS full scale</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> 2line(advanced radical distribution control)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Ar(754)/C4F8(43)/O2(46.8)/O2(1215)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CF4(336)/CHF3(163)/CH2F2(144)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CH3F(163)/N2(300)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CHF3(25.1)/O2(18.7)/N2(30)/CH2F2(14.4)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> RF 13.56MHz, max 5000W</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Temp Top +30~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Wall +40~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> ESC -10~+60</span><span style="font-size: 10pt;">℃</span></p><p> </p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">[Chamber B]</span></p><p><span style="font-family: Verdana, sans-serif;"> Chamber type:DRM</span></p><p><span style="font-family: Verdana, sans-serif;"> Gas config. (sccm)=FCS full scale</span></p><p><span style="font-family: Verdana, sans-serif;"> 2line(advanced radical distribution control)</span></p><p><span style="font-family: Verdana, sans-serif;"> Ar(754)/C4F8(43)/O2(46.8)/O2(1215)</span></p><p><span style="font-family: Verdana, sans-serif;"> CF4(336)/CHF3(163)/CH2F2(144)</span></p><p><span style="font-family: Verdana, sans-serif;"> CH3F(163)/N2(300)</span></p><p><span style="font-family: Verdana, sans-serif;"> CHF3(25.1)/O2(18.7)/N2(30)/CH2F2(14.4)</span></p><p><span style="font-family: Verdana, sans-serif;"> RF 13.56MHz, max 5000W</span></p><p><span style="font-family: Verdana, sans-serif;"> Temp Top +30~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Wall +40~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> ESC -10~+60</span><span style="font-size: 10pt;">℃</span></p><p> </p><p>Pictures will be collected.</p><p>Missing or damaged parts: Not reported.</p><p> </p>OEM Model Description
Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.Documents
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TEL / TOKYO ELECTRON
TELIUS SP 305 SCCM
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: 24 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
20225
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
TELIUS SP 305 SCCM
CATEGORY
Dry / Plasma Etch
Last Verified: 24 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
20225
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Dielectric EtchConfiguration
<p>Tool is operating in clean room.</p><p> </p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">[Chamber A]</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Chamber type:DRM</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Gas config. (sccm)=FCS full scale</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> 2line(advanced radical distribution control)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Ar(754)/C4F8(43)/O2(46.8)/O2(1215)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CF4(336)/CHF3(163)/CH2F2(144)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CH3F(163)/N2(300)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> CHF3(25.1)/O2(18.7)/N2(30)/CH2F2(14.4)</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> RF 13.56MHz, max 5000W</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Temp Top +30~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Wall +40~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> ESC -10~+60</span><span style="font-size: 10pt;">℃</span></p><p> </p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;">[Chamber B]</span></p><p><span style="font-family: Verdana, sans-serif;"> Chamber type:DRM</span></p><p><span style="font-family: Verdana, sans-serif;"> Gas config. (sccm)=FCS full scale</span></p><p><span style="font-family: Verdana, sans-serif;"> 2line(advanced radical distribution control)</span></p><p><span style="font-family: Verdana, sans-serif;"> Ar(754)/C4F8(43)/O2(46.8)/O2(1215)</span></p><p><span style="font-family: Verdana, sans-serif;"> CF4(336)/CHF3(163)/CH2F2(144)</span></p><p><span style="font-family: Verdana, sans-serif;"> CH3F(163)/N2(300)</span></p><p><span style="font-family: Verdana, sans-serif;"> CHF3(25.1)/O2(18.7)/N2(30)/CH2F2(14.4)</span></p><p><span style="font-family: Verdana, sans-serif;"> RF 13.56MHz, max 5000W</span></p><p><span style="font-family: Verdana, sans-serif;"> Temp Top +30~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> Wall +40~+80</span><span style="font-size: 10pt;">℃</span></p><p><span style="font-family: Verdana, sans-serif; font-size: 10pt;"> ESC -10~+60</span><span style="font-size: 10pt;">℃</span></p><p> </p><p>Pictures will be collected.</p><p>Missing or damaged parts: Not reported.</p><p> </p>OEM Model Description
Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.Documents
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