
Description
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KLA-TENCOR SP1 TBI UNPATTERNED SURFACE INSPECTION SYSTEM consisting of: - Model: SP1 TBI - Brooks Single 200/300mm FOUP - Unpatterned Surface Inspection System - Wafer Measurement Module - Triple Beam Illumination (TBI) - Normal Illumination- 0.079 Defect Sensitivity - Oblique Illumination- 0.060 Defect Sensitivity - Includes DB Enhancement Option - Includes GEM/SECS (Comm Port) Option - Includes GEM/SECS (HSMS) Option - Includes XY Coordinates Option - Blower BoxOEM Model Description
The SP1 is an unpatterned surface inspection system that can be configured with KLA-Tencor’s Triple-Beam Illumination™ (TBI) technology for exceptional sensitivity on rough films. This technology adds an oblique illumination beam to the SP1’s standard optical configuration, enhancing its ability to capture and distinguish all variations of pits, including crystal originated pits (COPs), from particles. The TBI option maintains the SP1’s axi-symmetric design and allows the use of Adaptive Collection Optics for superior capture of defects on different substrate surfaces.Documents
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SP1-TBI
CATEGORY
Defect Inspection
Last Verified: 4 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
138247
Wafer Sizes:
Unknown
Vintage:
2009
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
KLA-TENCOR SP1 TBI UNPATTERNED SURFACE INSPECTION SYSTEM consisting of: - Model: SP1 TBI - Brooks Single 200/300mm FOUP - Unpatterned Surface Inspection System - Wafer Measurement Module - Triple Beam Illumination (TBI) - Normal Illumination- 0.079 Defect Sensitivity - Oblique Illumination- 0.060 Defect Sensitivity - Includes DB Enhancement Option - Includes GEM/SECS (Comm Port) Option - Includes GEM/SECS (HSMS) Option - Includes XY Coordinates Option - Blower BoxOEM Model Description
The SP1 is an unpatterned surface inspection system that can be configured with KLA-Tencor’s Triple-Beam Illumination™ (TBI) technology for exceptional sensitivity on rough films. This technology adds an oblique illumination beam to the SP1’s standard optical configuration, enhancing its ability to capture and distinguish all variations of pits, including crystal originated pits (COPs), from particles. The TBI option maintains the SP1’s axi-symmetric design and allows the use of Adaptive Collection Optics for superior capture of defects on different substrate surfaces.Documents
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