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ASM EAGLE XP
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    Key Item Details

    Condition:Used

    Operational Status:

    Product ID:72423

    Wafer Sizes:12"/300mm

    Vintage:Unknown

    Description

    Moov Technology on behalf of Micron Technology Taiwan, Inc.

    Configuration

    -ARL Additional details attached below

    Documents
    OEM Model Description

    The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.

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