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ASM EAGLE XP
    Description
    ALD (Atomic Layer Deposition)
    Configuration
    No Configuration
    OEM Model Description
    The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.
    Documents

    No documents

    ASM

    EAGLE XP

    verified-listing-icon

    Verified

    CATEGORY
    ALD

    Last Verified: 24 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    23230

    Wafer Sizes:

    12"/300mm

    Vintage:

    2012

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    ASM EAGLE XP

    ASM

    EAGLE XP

    ALD
    Vintage: 2010Condition: Used
    Last VerifiedOver 60 days ago
    ASM EAGLE XP

    ASM

    EAGLE XP

    ALD
    Vintage: 2012Condition: Used
    Last VerifiedOver 60 days ago
    ASM EAGLE XP

    ASM

    EAGLE XP

    ALD
    Vintage: 2012Condition: Used
    Last Verified24 days ago

    ASM

    EAGLE XP

    verified-listing-icon
    Verified
    CATEGORY
    ALD
    Last Verified: 24 days ago
    listing-photo-Ygt86YzGBBFT5kDV0bgDirWwlw0fMLIu2xwqjqU4JJk-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    23230

    Wafer Sizes:

    12"/300mm

    Vintage:

    2012

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    ALD (Atomic Layer Deposition)
    Configuration
    No Configuration
    OEM Model Description
    The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.
    Documents

    No documents

    Similar Listings
    View All
    ASM EAGLE XP

    ASM

    EAGLE XP

    ALDVintage: 2010Condition: UsedLast Verified:Over 60 days ago
    ASM EAGLE XP

    ASM

    EAGLE XP

    ALDVintage: 2012Condition: UsedLast Verified:Over 60 days ago
    ASM EAGLE XP

    ASM

    EAGLE XP

    ALDVintage: 2012Condition: UsedLast Verified:24 days ago