We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. Read More
Description
ASM International Eagle XP EmerALD ALD (Atomic Layer Deposition)Configuration
Configuration : Tool Model : XP Platform System SW(OS) version is Ver 1. 58a1-001 All cables are present Robot Type is Yawuski Power Supply & AC Dist Box : P/N 1060-625-01 Backing Pump(s) : ALD/LL/WHC is EDWARDS-IXH1210 Heater Jacket : INTRACO TAIWAN CORPORATION Facility Requirements : CDA LLC PN2 : 403 DIW : 2.95 Vacuum Load Port vacuum : -86.2 Gas LLC Pressure : 0.56/0.209 MPA FI : 100 Pa Ar : 500 SCCM N2 : 500 SCCM Ar : 3 SLM Differential : 3.5 PaOEM Model Description
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.Documents
No documents
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
53755
Wafer Sizes:
12"/300mm
Vintage:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASM
EAGLE XP
CATEGORY
ALD
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
53755
Wafer Sizes:
12"/300mm
Vintage:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
ASM International Eagle XP EmerALD ALD (Atomic Layer Deposition)Configuration
Configuration : Tool Model : XP Platform System SW(OS) version is Ver 1. 58a1-001 All cables are present Robot Type is Yawuski Power Supply & AC Dist Box : P/N 1060-625-01 Backing Pump(s) : ALD/LL/WHC is EDWARDS-IXH1210 Heater Jacket : INTRACO TAIWAN CORPORATION Facility Requirements : CDA LLC PN2 : 403 DIW : 2.95 Vacuum Load Port vacuum : -86.2 Gas LLC Pressure : 0.56/0.209 MPA FI : 100 Pa Ar : 500 SCCM N2 : 500 SCCM Ar : 3 SLM Differential : 3.5 PaOEM Model Description
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.Documents
No documents