Description
No descriptionConfiguration
Process PE-ALD System Software Version Eagle I ASMJ software (Windows embedded XP / OS) Process PE-ALD Oxide, HT-SiO/HT-SiN Hardware Configuration (fab): Main System ASM PE-ALD System Mainframe 1 Handler System FI: Kawasaki / Vac: JEL 1 Factory Interface FOUP 2 Options System Others Process Chamber (RC3 / RC4) 2 Hardware Configuration (subfab/ auxiliary units): Power Rack 1 Missing/ Faulty Parts/ Accessories List: Throttle Valve 1 HF Generator 1 (Generator replaced)OEM Model Description
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.Documents
No documents
ASM
EAGLE XP
Verified
CATEGORY
ALD
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
67819
Wafer Sizes:
12"/300mm
Vintage:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASM
EAGLE XP
CATEGORY
ALD
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
67819
Wafer Sizes:
12"/300mm
Vintage:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Process PE-ALD System Software Version Eagle I ASMJ software (Windows embedded XP / OS) Process PE-ALD Oxide, HT-SiO/HT-SiN Hardware Configuration (fab): Main System ASM PE-ALD System Mainframe 1 Handler System FI: Kawasaki / Vac: JEL 1 Factory Interface FOUP 2 Options System Others Process Chamber (RC3 / RC4) 2 Hardware Configuration (subfab/ auxiliary units): Power Rack 1 Missing/ Faulty Parts/ Accessories List: Throttle Valve 1 HF Generator 1 (Generator replaced)OEM Model Description
The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.Documents
No documents