NT333™ has large wafer capacity as compared to single or dual wafer processing techniques. With the added capability of pre or post treatment steps included in each ALD cycle, NT333™ is capable of forming films of the highest quality while operating at low temperatures and providing tunable film stresses for a variety of applications. Additionally, NT333™ has unique plasma shield which mitigates plasma damage resulting in high quality films while maintain high stage rotation speeds.

TEL / TOKYO ELECTRON

NT333	

LAM RESEARCH CORPORATION

STRIKER

AVIZA

CELSIOR

The ASM EAGLE XP is an advanced wire bonder machine manufactured by ASM Assembly Systems, a division of ASM Pacific Technology. Wire bonding is a key process in semiconductor packaging that involves connecting integrated circuits (ICs) or other semiconductor devices to the package leads or interconnects using fine wires.

ASM is a supplier of semiconductor process equipment for wafer processing, including lithography, deposition, ion implant and single-wafer epitaxy. ASM is part of the ASM International NV group that also includes ASM Pacific Technology (ASMPT). ASMPT, in which ASMI holds a substantial ownership is a leading supplier of semiconductor process equipment for wafer assembly and packaging, and for surface mount technology.



6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

ALD

Overview

Services

Manufacturers of ALD

Top Products for ALD

NT333

STRIKER

CELSIOR

EAGLE XP