OXFORD

 Opal-PEALD

The FlexAL atomic layer deposition (ALD) system offers a broad range of optimised high-quality plasma ALD and thermal ALD processes with maximum flexibility in precursors, processes gases, and hardware configuration within a single process chamber.

- Remote plasma for low damage plasma ALD combined with thermal ALD in one deposition chamber
- RF biased electrode option available for control of film properties
- Industry-standard cassette to cassette handling for higher throughput
- Maximum flexibility in the choice of precursors, process gases, hardware features and options
- Optimised to maintain low-damage, high-quality substrates
- Removable liners allow for easy chamber maintenance
 -Low temperature to enable high-quality deposition on temperature-sensitive surfaces

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