SHINKAWA

UTC 370 BI

SBB-1100

UTC 435

UTC-3000 B1

UTC 200 BI

SBB 6

UTC 5100

UTV 250BI

ACB 400-S

SWB-FA UTC-5

SBB 410

UTV 300BI

ACB 400-S2

US 30

ACB 450

UTC 120

UTC 400K

UTC 200

UTC 475

UTC 250

UTC 1000S

UTC 235

UTC 300 BI SUPER

ACB 400

SRW 475 BI SUPER

UTC 250 BI

UTC 400

UTC 100

UTC 231 BI

UTC 434

COF 120

SBB 1410

SBB 310

SWB-FA-US 30

UTC 3000 SUPER

ACB 35S

UTV 475BI

ACB 35

UTC 300BI

ACB 1000

FPB-1WS

UTC 435BI

SRW 475 BI

UTC 380 BI

ILT 110

UTS 5100

UTC SUPER

UTC 200 BI SUPER II

The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operator

UTC 1000 SUPER

UTC 1000

UTC 2000

SHINKAWA UTC-2000 Super is an ultra-precise, fully automated wire bonder that is capable of producing up to 100 bonds per second with minimal handling time. It features integrated automated wire cleaning, alignment, vibration and thermal imaging systems for optimal efficiency and reliability.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

SHINKAWA

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Top SHINKAWA Wire / Wedge / Ball Bonder

UTC 120

UTC 200

UTC 400K

UTC 475

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