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Description
Wire BonderConfiguration
No ConfigurationOEM Model Description
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.Documents
No documents
PREFERRED
SELLER
Verified
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Buyer pays 12% premium of final sale price
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
101445
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View All
PREFERRED
SELLER
ASM
EAGLE XTREME
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Buyer pays 12% premium of final sale price
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
101445
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Wire BonderConfiguration
No ConfigurationOEM Model Description
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.Documents
No documents
Similar Listings
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EAGLE XTREME
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ASM
EAGLE XTREME
Wire / Wedge / Ball BonderVintage: 0Condition: UsedLast Verified:Over 60 days agoPREFERRED