Description
WIRE BOND Manufactured : 27-05-10Configuration
No ConfigurationOEM Model Description
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.Documents
No documents
ASM
EAGLE XTREME
Verified
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: 4 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
118088
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View All
ASM
EAGLE XTREME
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: 4 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
118088
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
WIRE BOND Manufactured : 27-05-10Configuration
No ConfigurationOEM Model Description
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.Documents
No documents