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Description
Introducing the new revolutionary high speed Eagle Xtreme wire bonder specifically designed to cater to the industry’s increasing advanced wire bonding applications. Eagle Xtreme features an ultra-light digital bond head and Dual Coil Linear Motor XY table for high speed bonding. High position and force control resolution gives unprecedented performance in ultra-fine pitch bonding. Fully programmable work holder and indexer system coupled with Windows based operating system provides a user friendly interface for easy setup and conversion.Configuration
No ConfigurationOEM Model Description
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.Documents
No documents
Verified
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79163
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View All
ASM
EAGLE XTREME
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79163
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Introducing the new revolutionary high speed Eagle Xtreme wire bonder specifically designed to cater to the industry’s increasing advanced wire bonding applications. Eagle Xtreme features an ultra-light digital bond head and Dual Coil Linear Motor XY table for high speed bonding. High position and force control resolution gives unprecedented performance in ultra-fine pitch bonding. Fully programmable work holder and indexer system coupled with Windows based operating system provides a user friendly interface for easy setup and conversion.Configuration
No ConfigurationOEM Model Description
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.Documents
No documents
Similar Listings
View AllASM
EAGLE XTREME
Wire / Wedge / Ball BonderVintage: 2010Condition: UsedLast Verified:Over 60 days agoPREFERRED
ASM
EAGLE XTREME
Wire / Wedge / Ball BonderVintage: 0Condition: UsedLast Verified:Over 60 days agoPREFERRED