Description
SP203 with 3 Chemistry Cabinets Power Requirements 200-208 V 50.0 A 50/60 Hz 3 PhaseConfiguration
6 Inch Bernoulli Handling; Pinlesschuck 6 Inch; Exhaust Up; 1 Medium Double Hex; 2 Medium Single Hex; Software: Major Version 117; Minor Version 2015.08.21; Gem Version GEM 5.8; 3 Chemistry Cabinetts: Cabinett 1: Maintank and Buffertank; Cabinett 2: Maintank and Buffertank; Cabinett 3: Maintank; Chemistry Controller-DosOEM Model Description
The SEZ 203 Spin-Processor is a single wafer processing system that can use up to three different chemical solutions in a programmable sequence for processing wafers. It is capable of processing wafers with sizes of 125mm, 150mm, and 200mm. It has options like Endpoint Detection System, ozone processing, and contamination-free robot handling. It supports applications such as Photolithography Yield Enhancement, Back Surface Metal Clean, and Silicon Etch. The system can recycle, heat, and filter chemical solutions or use them in a single pass mode.Documents
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Verified
CATEGORY
Wet Etch
Last Verified: 5 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
142800
Wafer Sizes:
6"/150mm
Vintage:
1998
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH / SEZ
SP203
CATEGORY
Wet Etch
Last Verified: 5 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
142800
Wafer Sizes:
6"/150mm
Vintage:
1998
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
SP203 with 3 Chemistry Cabinets Power Requirements 200-208 V 50.0 A 50/60 Hz 3 PhaseConfiguration
6 Inch Bernoulli Handling; Pinlesschuck 6 Inch; Exhaust Up; 1 Medium Double Hex; 2 Medium Single Hex; Software: Major Version 117; Minor Version 2015.08.21; Gem Version GEM 5.8; 3 Chemistry Cabinetts: Cabinett 1: Maintank and Buffertank; Cabinett 2: Maintank and Buffertank; Cabinett 3: Maintank; Chemistry Controller-DosOEM Model Description
The SEZ 203 Spin-Processor is a single wafer processing system that can use up to three different chemical solutions in a programmable sequence for processing wafers. It is capable of processing wafers with sizes of 125mm, 150mm, and 200mm. It has options like Endpoint Detection System, ozone processing, and contamination-free robot handling. It supports applications such as Photolithography Yield Enhancement, Back Surface Metal Clean, and Silicon Etch. The system can recycle, heat, and filter chemical solutions or use them in a single pass mode.Documents
No documents